Intermetallics formation between metallization conductor Pd-Ag and solder 62Sn-36Pb-2Ag have been investigated by transmission electron microscopy (TEM) and X-Ray diffraction. Energy-dispersive X-Ray (EDX) analysis and Selected Area Electron Diffraction (SAED) analysis reveals the formation of the intermetallic compounds and X-Ray diffraction results confirm the coexistence of the above metallurgical phases and additional intermetallic compounds including PdSn, and Evident single phase intermetallic compound (IMC) layer structure is not observed. The different intermetallic phases coexist near the metallization/solder interface. Silver-tin intermetallic compounds are also observed in the solder.
An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS. Manuscript received by the Electronic and Photonic Packaging Division August 3, 1998. Assoc. Editor: Y.-H. Pao.
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Li , G. Y., and Chan , Y. C. (July 26, 2002). "An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder ." ASME. J. Electron. Packag. September 2002; 124(3): 305–310. https://doi.org/10.1115/1.1486012
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