This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability predictions can be made based solely on monotonic test data. Various parametric studies of practical interest are conducted to obtain mechanistic insights into various aspects of damage in solders e.g., effect of hydrostatic stresses, grain size, ramp rate, etc.
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD December 21, 2001.
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Sharma, P., and Dasgupta, A. (July 26, 2002). "Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data ." ASME. J. Electron. Packag. September 2002; 124(3): 298–304. https://doi.org/10.1115/1.1493203
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