This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth, and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding, its blocking at second-phase particles, and diffusional creep relaxation. In Part II of this paper, the developed creep-fatigue damage model is quantified and parametric studies are provided to better illustrate the utility of the developed model.
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD December 21, 2001.
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Sharma, P., and Dasgupta, A. (July 26, 2002). "Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation ." ASME. J. Electron. Packag. September 2002; 124(3): 292–297. https://doi.org/10.1115/1.1493202
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