Efficient modeling strategies are developed to study thermomechanical durability of high I/O Ball Grid Array (BGA) packages, in order to facilitate virtual qualification and accelerated testing of component designs. A viscoplastic stress analysis technique is developed where the critical solder joint(s) (joint(s) where failure first occurs) are modeled in detail with a multi-domain Rayleigh-Ritz (MDRR) methodology while the load-sharing offered by noncritical joints is modeled with a simplified compact model. This hybrid technique is used to study the behavior of solder interconnects in selected Ball Grid Array (BGA) package under thermal cycling environments. Parametric studies are conducted to determine the optimal scheme for allocating a critical number of solder joints to the MDRR model, and the remaining non-critical joints to the compact models. Damage calculations are made with the Energy Partitioning Solder Durability model and cycles-to-failure predictions are compared with both finite element model predictions as well as experimental failure data provided by CALCE EPSC sponsors. Parametric studies on change in solder joint durability with interconnect volume are also discussed in this paper.
Thermomechanical Durability of High I/O BGA Packages
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters, September 20, 2001. Associate Editor: J. Lau.
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Davuluri , P., Shetty , S., Dasgupta, A., and Young, S. (July 26, 2002). "Thermomechanical Durability of High I/O BGA Packages ." ASME. J. Electron. Packag. September 2002; 124(3): 266–270. https://doi.org/10.1115/1.1477192
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