Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation of the salt to release ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone.
Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo.
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Xu, Y., Luo, X., and Chung, D. D. L. (July 26, 2002). "Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance ." ASME. J. Electron. Packag. September 2002; 124(3): 188–191. https://doi.org/10.1115/1.1477191
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