A simple non-local modified beam model is presented to evaluate interfacial thermal stresses in bimaterial elastic beams. The model has its root in an earlier model (Suhir 1986) which assumes that the longitudinal interfacial displacement at a point depends on the interfacial shear stress at that point. Different than that earlier local model, however, the present non-local model assumes that the longitudinal interfacial displacement at a point also depends on the second gradient of the interfacial shear stress at that point. The present model satisfies both the zero-longitudinal force and the zero-shear stress boundary conditions at the free edges, and the interfacial peeling stress given by the present model is self-equilibrated. Remarkably, the present model leads to a fourth-order differential equation for the interfacial shear stress, and is considerably simpler than other known modified beam models satisfying the abovementioned conditions. This desirable feature of the present model is believed to be significant especially when the model is applied to multilayered materials. In particular, the interfacial shear stress given by the present model is found to be in reasonably good agreement with some known numerical results.
Skip Nav Destination
Article navigation
September 2002
Technical Papers
Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
C. Q. Ru
C. Q. Ru
Department of Mechanical Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G8
Search for other works by this author on:
C. Q. Ru
Department of Mechanical Engineering, University of Alberta, Edmonton, Alberta, Canada T6G 2G8
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters October 14, 2001. Associate Editor: B. Michel.
J. Electron. Packag. Sep 2002, 124(3): 141-146 (6 pages)
Published Online: July 26, 2002
Article history
Received:
October 14, 2001
Online:
July 26, 2002
Citation
Ru, C. Q. (July 26, 2002). "Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited ." ASME. J. Electron. Packag. September 2002; 124(3): 141–146. https://doi.org/10.1115/1.1481037
Download citation file:
Get Email Alerts
Enhancing Image Segmentation Model in Computing Void Percentage with Mask RCNN
J. Electron. Packag
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
Related Articles
Plane Thermal Stress Analysis of an Orthotropic Cylinder Subjected to an Arbitrary, Transient, Asymmetric Temperature Distribution
J. Appl. Mech (September,2002)
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
J. Electron. Packag (March,2003)
Boundary Element Formulation for Thermal Stresses During Pulsed Laser Heating
J. Appl. Mech (May,2001)
Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
J. Electron. Packag (September,2001)
Related Proceedings Papers
Related Chapters
Flexibility Analysis
Process Piping: The Complete Guide to ASME B31.3, Third Edition
Analysis of Components in VIII-2
Guidebook for the Design of ASME Section VIII Pressure Vessels, Third Edition
Structural Performance of Thermo-Active Foundations
Thermoactive Foundations for Sustainable Buildings