Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations, under assumed operating conditions. Because of lacking insight into the mechanical processes due to polymer curing, the impact of processing induced residual stress fields is often neglected. To investigate the evolution of stress and strain fields during the curing process it is important to assume a more appropriate starting point for subsequent process modeling. Furthermore, study of possible damage originating from the fabrication process then comes within reach. To facilitate future analysis of stress and strain fields during the curing process a cure dependent constitutive relation is assumed. An approximate investigation method for the process-dependent mechanical properties, based on Dynamic Mechanic Analysis (DMA), is developed. As an illustration the parameter identification is performed for a selected epoxy resin.
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD July 6, 2000. Associate Editor: S. M. Heinrich.
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Ernst, L. J., van ’t Hof , C., Yang , D. G., Kiasat, M. S., Zhang, G. Q., Bressers , H. J. L., Caers , J. F. J., den Boer , A. W. J., and Janssen, J. (May 2, 2002). "Mechanical Modeling and Characterization of the Curing Process of Underfill Materials ." ASME. J. Electron. Packag. June 2002; 124(2): 97–105. https://doi.org/10.1115/1.1459471
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