In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. Based on the dislocation controlled creep mechanism and Gibbs’ free-energy theory, a new creep constitutive model was proposed. The model was found to describe accurately the creep flow of the solder and to be capable of explaining the issues of stress and temperature dependent stress exponent and activation energy in the Arrhenius power-law creep model. Furthermore, the model was employed to predict accurately the long-term reliability of solder joints in a PBGA assembly.

1.
Morris, J. W., Jr., Tribula, D., Summers, T. S. E., and Grivas, D., 1991, “The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints,” Solder Joint Reliability: Theory and Applications, J. Lau, ed. pp. 243–248.
2.
Pao
,
Y. H.
,
Badgley
,
S.
,
Jih
,
E.
,
Govila
,
R.
, and
Browning
,
J.
,
1993
, “
Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
,”
ASME J. Electron. Packag.
,
115
, pp.
147
152
.
3.
Darveaux
,
R.
, and
Banerji
,
K.
,
1992
, “
Constitutive Relations for Tin-Based Solder Joints
,”
IEEE CHMT-A
,
15
, pp.
1013
1024
.
4.
Knecht
,
S.
, and
Fox
,
L. R.
,
1990
, “
Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder
,”
IEEE CHMT-A
,
13
, pp.
424
433
.
5.
Hacke
,
P.
,
Sprecher
,
A. F.
, and
Conrad
,
H.
,
1993
, “
Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening
,”
ASME J. Electron. Packag.
,
115
, pp.
153
158
.
6.
Syed
,
A. R.
,
1995
, “
Creep Crack Growth Prediction of Solder Joints during Temperature Cycling—An Engineering Approach
,”
ASME J. Electron. Packag.
,
117
, pp.
116
122
.
7.
Shi
,
X. Q.
,
Zhou
,
W.
,
Pang
,
H. L. J.
, and
Wang
,
Z. P.
,
1999
, “
Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
,”
ASME J. Electron. Packag.
,
121
, pp.
179
185
.
8.
Hertzberg, R. W., 1996, Deformation and Fracture Mechanics of Engineering Materials, Wiley, New York.
9.
Frost, H. J., and Ashby, M. F. 1982, Deformation-Mechanism Maps—The Plasticity and Creep of Metals and Ceramics, Pergamon Press, New York.
10.
Kocks, U. F., Argon, A. S., and Ashby, M. F., 1975, Thermodynamics and Kinetics of Slip, Progress in Material Science, Pergamon Press, New York.
11.
McCabe
,
R. J.
, and
Fin
,
M. E.
,
1998
, “
Athermal and Thermally Activated Plastic Flow in Low Melting Temperature Solders at Small Stresses
,”
Scr. Mater.
,
39
, No.
2
, pp.
189
195
.
12.
Lau, J., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, Flip Chip, CSP, and Fine Pitch SMT Assemblies, Van Nostrand Reinhold, New York.
13.
Shi
,
X. Q.
,
Pang
,
H. L. J.
,
Zhou
,
W.
, and
Wang
,
Z. P.
,
1999
, “
A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy
,”
Scr. Mater.
,
41
, pp.
289
296
.
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