This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function.
Thermal Math Modeling and Analysis of an Electronic Assembly
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD May 5, 2000. Associate Editor: S. M. Heinrich.
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Shukla, K. N. (May 5, 2000). "Thermal Math Modeling and Analysis of an Electronic Assembly ." ASME. J. Electron. Packag. December 2001; 123(4): 372–378. https://doi.org/10.1115/1.1388561
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