Reducing integrated circuit (IC) plastic packaging production costs by improving the transfer mold and leadframe designs is a costly and time-consuming process. Rather than building mold and leadframe prototypes to perform empirical studies, this research describes how C-MOLD, a microchip encapsulation simulation software application, was used to validate and optimize an innovative mold and leadframe design that has the potential to reduce raw material waste associated with packaging by more than 59 percent. Estimates indicate that the proposed design will cut annual production costs by more than $600,000.
Issue Section:
Additional Technical Papers
1.
Electronic Trends Publications, 1999 “The Worldwide IC Packaging Market.”
2.
Han
, S.
, and Wang
, K.
, 1995
, “A Study on Wire Sweep ion Encapsulation of Semiconductor Chips Using Simulated Experiments
,” ASME J. Electron. Packag.
, 117
, pp. 178
–184
.3.
Pecht, M., Dasgupta, A., and Evans, J., 1994, Quality Conformance and Qualification of Microelectronic Packages and Interconnects, Wiley, New York.
4.
Nguyen, L. T., Danker, A. S, Santhiran, N., and Shervin, C. R., 1992, “Flow Modeling of Wire Sweep During Molding of Integrated Circuits,” Proceedings, ASME Winter Annual Meeting, Anaheim, CA, pp. 27.
5.
Nguyen, L. T., and Lim, F. J., 1990, “Wire Sweep During Molding of Integrated Circuits,” Proceedings, Electronic Components and Technology Conference, IEEE, pp. 777–785.
6.
Cypress Semiconductor, 1998.
7.
Hieber, C. A., 1987, Injection and Compression Modeling Fundamentals, Marcel Dekker, New York.
8.
Kamal, M. R., Sourour, S., and Ryan, M., 1973, “Integrated Thermo-Rheological Analysis of the Cure of Thermosets,” Proceedings, 31st SPE ANTEC, Montreal, Canada.
9.
Han, S., and Wang, K. K. 1995, “Flow Analysis in a Cavity with Leadframe During Semiconductor Chip Encapsulation,” Proceedings, International Intersociety Electronic Packaging Conference, Lahaina, Hawaii.
10.
Advancd CAE Technology, 1997, C-Mold Microchip Encapsulation User’s Guide, Ithaca, New York.
11.
Bird, R., Armstrong, R., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1, Wiley-Interscience, New York.
12.
Huebner, K., and Thornton, E., 1987, The Finite Element Method for Engineers Wiley, New York.
13.
Nguyen, S., 1998, Advanced CAE Technology, Ithaca, New York.
14.
Advanced CAE Technology, 1997, C-Mold Design Guide, Ithaca, New York.
15.
Berins, M. L., 1991, Plastics Engineering Handbook, Society of the Plastics Industry, ed., 5th edition, Van Nostrand Reinhold, New York.
Copyright © 2001
by ASME
You do not currently have access to this content.