Reducing integrated circuit (IC) plastic packaging production costs by improving the transfer mold and leadframe designs is a costly and time-consuming process. Rather than building mold and leadframe prototypes to perform empirical studies, this research describes how C-MOLD, a microchip encapsulation simulation software application, was used to validate and optimize an innovative mold and leadframe design that has the potential to reduce raw material waste associated with packaging by more than 59 percent. Estimates indicate that the proposed design will cut annual production costs by more than $600,000.
Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters February 6, 2001. Associate Editor: B. Michel.
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Beyerlein, D., and Hornberger, L. E. (February 6, 2001). "Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept ." ASME. J. Electron. Packag. December 2001; 123(4): 366–371. https://doi.org/10.1115/1.1388562
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