The stress ratio effect on the fatigue crack growth behavior of 95Pb-5Sn solder has been investigated. It is found that both and can correlate fatigue crack growth data well, which means that the crack growth behavior of the 95Pb-5Sn solder under the frequency of 10 Hz was dominantly cyclic dependent. The relationship can be expressed as: Low level of crack closure was found only in the near-threshold region. Except in this region, no crack closure was observed in the present test conditions. Both transgranular and intergranular fractures were observed on fracture surfaces: the former was dominant in most test conditions and the latter was dominant at the high stress ratio of 0.7. Striations and striation-like features were also found. Many slip bands and cavities along the grain boundary were observed on the crack wake and ahead of the crack tip in the high crack growth rate region.
Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD March 17, 1999. Associate Editor: Yi-Hsin Pao.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Zhao and , J., Mutoh , Y., and Ogawa , T. (March 17, 1999). "Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder ." ASME. J. Electron. Packag. September 2001; 123(3): 311–315. https://doi.org/10.1115/1.1371780
Download citation file:
- Ris (Zotero)
- Reference Manager