Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles.
Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement
Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS. Manuscript received by the EPPD June 26, 2000. Associate Editor: R. Wirtz.
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Luo, , X., Xu, and , Y., and Chung , D. D. L. (June 26, 2000). "Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement ." ASME. J. Electron. Packag. September 2001; 123(3): 309–311. https://doi.org/10.1115/1.1371925
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