The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same “heating factor” but to have different conveyor speeds. The test results show that, by increasing the conveyor speed during reflow, the shear fatigue lifetime of solder joints can be improved substantially. On the other hand, the fatigue lifetime of the test specimens decreased with increasing the cycle displacement amplitude. Heat transmission analysis shows that increasing conveyor speed increases the cooling rate during solder solidification. SEM micrographs reveal that cracks initiated at the acute point near the PCB solder pad, then propagate along the interface of the bulk solder/IMC layer. The test results are ascribed to roughing interface of the bulk solder/IMC of the solder joints that results on increasing the cooling rate. The frictional sliding mechanism is used to explain the test results.
Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD July 14, 1999. Associate Editor. S. Heinrich.
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Fan, S. H., Chan, Y. C., and Lai , J. K. L. (July 14, 1999). "Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds ." ASME. J. Electron. Packag. September 2001; 123(3): 290–294. https://doi.org/10.1115/1.1347997
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