This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60 Sn-40 Pb solder. Based on the theory of damage mechanics, a two-scalar damage model is developed for isotropic materials by introducing the free energy equivalence principle. The damage evolution equations are derived in terms of the damage energy release rates. In addition, a failure criterion is developed based on the postulation that a material element is said to have ruptured when the equivalent damage accumulated in the element reaches a critical value. The damage coupled viscoplasticity model is discretized and coded in a general-purpose finite element program known as ABAQUS through its user-defined material subroutine UMAT. To illustrate the application of the model, several example cases are introduced to analyze, both numerically and experimentally, the tensile creep behaviors of the material at three stress levels. The model is then applied to predict the deformation of a notched specimen under monotonic tension at room temperature (22°C). The results demonstrate that the proposed model can successfully predict the viscoplastic behavior of the solder material.
Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD October 20, 1999. Associate Editor: S. M. Heinrich.
- Views Icon Views
- Share Icon Share
- Cite Icon Cite
- Search Site
Wei , Y., Chow, C. L., Fang , H. E., and Neilsen, M. K. (October 20, 1999). "Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material ." ASME. J. Electron. Packag. September 2001; 123(3): 278–283. https://doi.org/10.1115/1.1372319
Download citation file:
- Ris (Zotero)
- Reference Manager