The present study examines the relationship between thermal conductivity and planarity in polyimide films. The samples tested were specially prepared to range in orientation from three dimensionally random to highly planar. The molecular structure and orientation of the polyimide film have been characterized by polarizing microscope techniques, while the thermal conductivity measurements were done using a new rapid nondestructive technique. This correlation represents the first time thermal conductivity has been measured by modified hot wire techniques and related to the internal structure of polyimide. This work contributes to a deeper theoretical understanding of thermal conductivity and heat transfer mechanisms as they relate to orientation. Thermal conductivity evaluation could provide a new tool in the arsenal of structural characterization techniques. This relationship between thermal conductivity and orientation is key for applications of directional heat dissipation in the passive layers of chip assemblies. Such a correlation has potential to speed the development cycles of new materials during formulation as well as assure properties during production.
Orientation Specific Thermal Properties of Polyimide Film
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Revised manuscript received by the EEPD March 10, 2000. Associate Editor: R. Schmidt.
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Samuels, R. J., and Mathis, N. E. (March 10, 2000). "Orientation Specific Thermal Properties of Polyimide Film ." ASME. J. Electron. Packag. September 2001; 123(3): 273–277. https://doi.org/10.1115/1.1347986
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