A unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging. The material parameters of the constitutive relations for 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, and 97.5Pb2.5Sn solders were determined from separated constitutive relations and experimental results. The achieved unified Anand model for solders were tested for constant strain rate testing, steady-state plastic flow and stress/strain responses under cyclic loading. It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress/strain responses of solder joints in service.
Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD October 20, 1998. Associate Editor: Ye-Hein Pao.
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Wang, G. Z., Cheng, Z. N., Becker, K., and Wilde, J. (October 20, 1998). "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys ." ASME. J. Electron. Packag. September 2001; 123(3): 247–253. https://doi.org/10.1115/1.1371781
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