The time- and temperature-dependent deformation behavior of two Sn-Ag base alloys, 96Sn-4Ag and Castin (96.2Sn-2.5Ag-0.8Cu-0.5Sb), used as solder interconnect materials was determined over strain rates ranging from to and temperatures ranging from −55°C–125°C. Uniaxial strain rate jump tests along with isothermal and thermomechanical cyclic tests were conducted. The constitutive behavior of each alloy was modeled with both a simple power law creep equation and the McDowell unified creep-plasticity model. Accumulated deformation under unconstrained thermal cycling was also measured to determine the relative dimensional stability due to internal constraints in the alloy itself. Overall, the Castin alloy appeared to be more stable and was more resistant to inelastic deformation.
Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters December 12, 2000. Associate Editor: Y. Pao.
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Neu , R. W., Scott , D. T., and Woodmansee, M. W. (December 12, 2000). "Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy ." ASME. J. Electron. Packag. September 2001; 123(3): 238–246. https://doi.org/10.1115/1.1371232
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