This paper reports the results of CFD analysis to cool the 30-W socketed CPU of a desktop computer with minimum air flow rate and minimum heat sink size. This was achieved using only the fan in the power supply for all air movement in the chassis. A duct was employed to direct the air flow over the CPU and then to the inlet air vents of the power supply. Use of this duct allowed more than 10°C reduction of the CPU case temperature, relative to an unducted design. The CFD analysis results were confirmed by experiment, and the predicted CPU case temperatures agreed within ±2.9°C of the experimental values for the ducted cases. This paper describes the methodology of CFD analysis for the heat sink/duct design, and describes experimental procedures to validate the predictions.
Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters October 11, 2000. Associate Editor: R. Wirtz.
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Chang , J. Y., Yu , C. W., and Webb, R. L. (October 11, 2000). "Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling ." ASME. J. Electron. Packag. September 2001; 123(3): 225–231. https://doi.org/10.1115/1.1348012
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