A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input and the junction temperature. This has been done for both steady-state operating conditions and for pulses. The role of phase change materials (PCMs) in suppressing temperature elevations during pulses is also addressed.
Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD November 29, 1999; revised manuscript received October 2000. Associate Editor: B. Michel.
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Evans, A. G., He, M. Y., Hutchinson, J. W., and Shaw, M. (October 1, 2000). "Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses ." ASME. J. Electron. Packag. September 2001; 123(3): 211–217. https://doi.org/10.1115/1.1370376
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