A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input and the junction temperature. This has been done for both steady-state operating conditions and for pulses. The role of phase change materials (PCMs) in suppressing temperature elevations during pulses is also addressed.
Issue Section:
Technical Papers
1.
ASM Electronics Materials Handbook, 1986, Volume 1, Packaging, ASM International.
2.
Taraseiskey, H., 1996, Power Hybrid Circuit Design and Manufacture, Marcel Dekker, Inc.
3.
Sze, S. M., 1981, Physics of Semiconductor Devices, Wiley, NY.
4.
McCluskey, F. P., 1997, High Temperature Electronics, CRC Press.
5.
Tummala, R. R., and Rymaszewski, E. J., 1989, Microelectronics Packaging Handbook, Van Nostrand Reinhold.
6.
NASA CR-61363, 1971, Phase-Change Materials Handbook.
7.
NASA Technical Paper 1074, “A Design Handbook for Phase Change Thermal Control and Energy Storage Devices.”
8.
Lu
, T. J.
, Evans
, A. G.
, and Hutchinson
, J. W.
, 1998
, ASME J. Electron. Packag.
, 120
, pp. 280
–289
.9.
Van Vodbold
, C.
, Sankaran
, V. A.
, and Hudgins
, J. L.
, 1997
, IEEE Trans. On Power Electronics
, 12
, pp. 3
3
.10.
Lu
, T. J.
, Stone
, H. A.
, and Ashby
, M. F.
, 1998
, Acta Mater.
, 46
, pp. 3619
–3635
.11.
Neugebauer, C. A., Yerman, A. F., Carlson, R. O., Burgess, J. F., Webster, H. F., and Glascock, J. H., 1986, The Packaging of Power Semiconductor Devices, Gordon and Breach, NY.
12.
Lu
, T. J.
, 2000
, Int. J. Heat Mass Transf.
, 43
, pp. 2245
–2256
.13.
Laouadi
, A.
, and Lacroix
, M.
1999
, Int. J. Heat Mass Transf.
, 42
, pp. 275
–286
.14.
Muehlbauer
, J. C.
, and Sunderland
, J. E.
, 1965
, Appl. Mech. Rev.
, 18
, pp. 951
–957
.Copyright © 2001
by ASME
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