A means to properly size rectangular heat spreaders between a dielectric layer connected to thermal ground and a power device is developed by modeling the problem as a thermal resistance network. Generalized formulas and nondimensional charts to optimize heat spreader thickness and footprint are presented. The power device and heat spreader are assumed to be (concentric) rectangular solids of arbitrary length, width and thickness. The nondimensional results are validated by finite element analysis (FEA) and examples demonstrate the utility of the methodology to thermal design engineers.
Sizing of Heat Spreaders Above Dielectric Layers
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD April 28, 2000; revised manuscript received February 12, 2001. Associate Editor: R. Wirtz.
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Chen, C., Hodes, M., and Manzione, L. (February 12, 2001). "Sizing of Heat Spreaders Above Dielectric Layers." ASME. J. Electron. Packag. September 2001; 123(3): 173–181. https://doi.org/10.1115/1.1377271
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