The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.

Issue Section:
Papers on Reliability
Keywords:
ball grid arrays, reliability, moulding, fine-pitch technology
Topics:
Ball-Grid-Array packaging, Fracture (Materials), Molding, Solders, Warping, Insulation, Reliability, Fillers (Materials)
1.
Minjin, K., Myungwhan, K., Dongsuk, S., Yongjoon, P., Myungsun, M., and Inhee, L., 1997, “Investigation on the Effect of Molding Compounds On Package Delamination,” IEEE 47th Electronic Components & Technical Conference, pp. 1242–1247.
2.
Yong, T., Ee, W., and Thiam, L., 1998, “Enhancing Moisture Resistance of PBGA,” IEEE 48th Electronic Components & Technical Conference, pp. 930–935.
Copyright © 2001
 by ASME
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