The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.
Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters August 8, 2000. Associate Editor: B. Courtois
Aihara, T., Ito , S., Sasajima , H., and Oota, K. (August 8, 2000). "Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials ." ASME. J. Electron. Packag. March 2001; 123(1): 88–94. https://doi.org/10.1115/1.1329129
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