A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick’s law by taking into account the delayed response between the interdiffusion of two dissimilar materials and the chemical reaction that forms the IMC. The merit of this model is that it uniquely represents four different types of IMC growth kinetics, all of which are found in the literature. Comparison between the model and experimental results for 100Sn/Cu and Ag/Zn systems demonstrates that the proposed DPLD model captures the growth history of IMC layers quite well.
A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD June 23, 1999; revised manuscript received June 27, 2000. Associate Editor: D. T. Read.
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Chen , J. K., Beraun, J. E., and Tzou, D. Y. (June 27, 2000). "A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints ." ASME. J. Electron. Packag. March 2001; 123(1): 52–57. https://doi.org/10.1115/1.1326438
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