A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick’s law by taking into account the delayed response between the interdiffusion of two dissimilar materials and the chemical reaction that forms the IMC. The merit of this model is that it uniquely represents four different types of IMC growth kinetics, all of which are found in the literature. Comparison between the model and experimental results for 100Sn/Cu and Ag/Zn systems demonstrates that the proposed DPLD model captures the growth history of IMC layers quite well.

Issue Section:
Technical Papers
Keywords:
soldering, chemical interdiffusion
Topics:
Diffusion (Physics), Intermetallic compounds, Solder joints, Chemical reactions
1.
Yost
,
F. G.
,
Ganyard
,
F. P.
, and
Karnowsky
,
M. M.
,
1976
, “
Layer Growth in Au-Pb/In Solder Joints
,”
Metall. Trans.
,
7A
, pp.
1141
–
1148
.
2.
Romig
,
A.
,
Yost
,
R.
, and
Hlava
,
P.
,
1984
, Report No. SANDIA84-0575, Sandia National Laboratories, Albuquerque, NM.
3.
Wu
,
Y.
,
Sees
,
J. A.
,
Pouraghabagher
,
C.
,
Foster
,
L. A.
,
Marshall
,
J. L.
,
Jacobs
,
E. G.
, and
Pinizzotto
,
R. F.
,
1993
, “
The Formation and Growth of Intermetallics in Composite Solder
,”
J. Electron. Mater.
,
22
, No.
7
, pp.
769
–
777
.
4.
Erickson
,
K. L.
,
Hopkins
,
P. L.
, and
Vianco
,
P. T.
,
1994
, “
Solid State Intermetallic Compound Growth Between Copper and High Temperature, Tin-Rich Solders-Part II: Modeling
,”
J. Electron. Mater.
,
23
, No.
8
, pp.
729
–
734
.
5.
Erickson
,
K. L.
,
Hopkins
,
P. L.
, and
Vianco
,
P. T.
,
1998
, “
Modeling the Solid State Reaction Between Sn-Pb Solder and a Porous Substrate Coating
,”
J. Electron. Mater.
,
27
, No.
11
, pp.
1177
–
1192
.
6.
Frear
,
D. R.
, and
Vianco
,
P. T.
,
1994
, “
Intermetallic Growth and Mechanical Behavior of Low and High Melting Temperature Solder Alloys
,”
Metall. Mater. Trans. A
,
25A
, pp.
1509
–
1523
.
7.
Vianco
,
P. T.
,
Killgo
,
A. C.
, and
Grant
,
R.
,
1995
, “
Intermetallic Compound Layer Growth by Solid State Reactions Between 58Bi-42Sn Solder and Copper
,”
J. Electron. Mater.
,
24
, No.
10
, pp.
1493
–
1505
.
8.
Kang
,
S. K.
,
Rai
,
R. S.
, and
Purushothaman
,
S.
,
1996
, “
Interfacial Reactions During Soldering with Lead-Tin Eutectic and Lead (Pb)-Free, Tin-Rich Solders
,”
J. Electron. Mater.
,
25
, No.
7
, pp.
1113
–
1120
.
9.
Schaefer
,
M.
,
Laub
,
W.
,
Sabee
,
J. M.
, and
Fournelle
,
R. A.
,
1996
, “
A Numerical Method for Predicting Intermetallic Layer Thickness Developed During the Formation of Solder Joints
,”
J. Electron. Mater.
,
25
, No.
6
, pp.
992
–
1003
.
10.
Schaefer
,
M.
,
Fournelle
,
R. A.
, and
Liang
,
J.
,
1998
, “
Theory for Intermetallic Phase Growth Between Cu and Liquid Sn-Pb Solder Based on Grain Boundary Diffusion Control
,”
J. Electron. Mater.
,
23
, No.
11
, pp.
1167
–
1175
.
11.
Chen
,
S. W.
,
Chen
,
C. M.
, and
Liu
,
W. C.
,
1998
, “
Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions
,”
J. Electron. Mater.
,
27
, No.
11
, pp.
1193
–
1197
.
12.
Williams
,
D. S.
,
Rapp
,
R. A.
, and
Hirth
,
J. P.
,
1981
, “
Multilayer Diffusional Growth in Silver-Zinc Alloys
”
Metall. Mater. Trans. A
,
12A
, pp.
639
–
652
.
13.
Chen
,
J. K.
,
Beraun
,
J. E.
, and
Tzou
,
D. Y.
,
1999
, “
A Dual-Phase-Lag Diffusion Model for Interfacial Layer Growth in Metal Matrix Composites
,”
J. Mater. Sci.
,
34
, pp.
6183
–
6187
.
14.
Chen
,
J. K.
,
Beraun
,
J. E.
, and
Tzou
,
D. Y.
,
2000
, “
A Dual-Phase-Lag Diffusion Model for Predicting thin film Growth
,”
Semicond. Sci. Technol.
,
15
, pp.
235
–
241
.
15.
Incropera, F. P., and Dewitt, D. P., 1985, Fundamentals of Heat and Mass Transfer, Wiley, New York.
16.
Tzou, D. Y., 1997, Macro- to Micro-scale Heat Transfer: The Lagging Behavior, Tayor & Francis, Washington DC.
17.
Tzou
,
D. Y.
, and
Zhang
,
Y. S.
,
1995
, “
An Analytical Study on the Fast-Transient Process in Small Scales
,”
Int. J. Eng. Sci.
,
33
, pp.
1449
–
1463
.
18.
Bertman
,
B.
, and
Sandiford
,
D. J.
,
1970
, “
Second Sound in Solid Helium
,”
Sci. Am.
,
222
, pp.
92
–
101
.
19.
Yost, F. G., and Tzou, D. Y., 1992, “Nonhomogeneous Grain Growth Due to Shear,” Symposium on Modeling of Coarsening and Grain Growth: Non-Ideal Grain Growth, TMS Physical Metallurgy Committee, Chicago, Illinois, Nov. 1–5.
Copyright © 2001
 by ASME
You do not currently have access to this content.