The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.
Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received at ASME Headquarters November 29, 2000. Associate Editor: V. Sarihan.
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Polsky , Y., and Ume, I. C. (November 29, 2000). "Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards ." ASME. J. Electron. Packag. March 2001; 123(1): 1–5. https://doi.org/10.1115/1.1343111
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