The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.

Issue Section:
Technical Papers
Keywords:
printed circuits, shear deformation, laminates
Topics:
Deflection, Lamination, Plane strain, Printed circuit boards, Shear (Mechanics), Shear deformation, Stress, Temperature, Warping, Laminates
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