Knowledge at the intersection of reliability, mechanical, materials, chemical, electrical, optical, manufacturing and software engineering holds the key to the viable and reliable microelectronics and photonics products and systems of the future

In this issue we introduce a new section of our Journal—Reliability of Microelectronics, Photonics and MEMS Materials and Packages. Our intent is to disseminate the state-of-the-art information pertaining to various reliability problems encountered in the design, manufacturing, testing, and operation of microelectronic, photonic and MEMS materials, devices, packages, equipment, and systems. This section is intended to provide a forum that will enable engineers and researchers to exchange information about reliability issues in “high-tech” engineering. Although many reliability problems in microelectronics and photonics packaging were and will be reflected and discussed in other papers of the Journal, we will try to collect, whereever possible, the most important papers devoted to various reliability problems in...

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