Three-dimensional nonlinear finite element analysis of a ceramic ball grid array (CBGA) package was conducted to determine the solder joint creep and plastic strain deformations in a simulated thermal cycling loading. Two methods of analysis were carried out to model the creep deformations during the dwell and during the temperature ramps in the thermal cycling loading. The equivalent plastic and creep strains are presented for the two analysis method to demonstrate the differences in the strain components. Both creep and plastic strain fatigue life prediction models were used to estimate the thermal cycling life of CBGA solder joints subjected to accelerated thermal cycling tests. The lives predicted using this nonlinear finite element analysis results were satisfactory and conservative compared to the experimental test results. [S1043-7398(00)01103-8]
CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Associate Technical Editor: Yi-Hsin Pao.
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Pang, J. H. L., Seetoh, C. W., and Wang, Z. P. (September 1, 2000). "CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis ." ASME. J. Electron. Packag. September 2000; 122(3): 255–261. https://doi.org/10.1115/1.1286120
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