The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a computer controlled 6-axis mini-fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study, the new lead free solder alloy shows very attractive characteristics and may have potential applications in electronics packaging products.
Issue Section:
Technical Papers
Topics:
Alloys,
Lead-free solders,
Strips,
Fatigue,
Computers,
Creep,
Electronic packaging,
Solders,
Testing,
Thermomechanics
1.
Adams, P. J., 1997, “Thermal Fatigue of Solder Joints in Micro-Electronic Devices,” M. S. thesis, Dept. of Mech. Eng., MIT, Cambridge, MA.
2.
CINDAS, 1997, SRC Document, Purdue University, West Lafayette, IN.
3.
Darveaux
R.
Banerji
K.
1992
, “Constitutive Relations for Tin-Based Solder Joints
,” IEEE Trans. on Components, Hybrids, and Manufacturing Tech.
, Vol. 15
, No. 6
, pp. 1013
–1024
.4.
Ewell, G. J., and Robertson, S. R., 1996, “Development of Pb-free Solder: An Overview,” Proceedings, The Second Int. Symp. on Elec. Packag. Tech., Shanghai, China, pp. 73–78.
5.
Frear, D. R., Jones, W. B., and Kinsman, K. R., 1990, Solder Mechanics, A State of the Art Assessment, TMS, New Mexico.
6.
Frear
D. R.
1989
, “Thermo-Mechanical Fatigue of Solder Joints: A New Comprehensive Test Method
,” IEEE Trans. on Components, Hybrids, and Manufacturing Tech.
, Vol. 12
, pp. 492
–501
.7.
Glazer
J.
1994
, “Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review
,” J. Elec. Mat.
, Vol. 23
, pp. 693
–700
.8.
Kang
S. K.
1994
, “Lead(Pb)-Free Solders for Electronic Packaging
,” J. Elec. Mat.
, Vol. 23
, pp. 701
–707
.9.
Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold, New York.
10.
Lu, M., Ren, W., and Liu, S., 1996, “A Unique Multi-Axial Thermo-Mechanical Fatigue Tester For Electronic Packaging Materials,” Presented at the Second International Symposium on Electronic Packaging Technology, Shanghai, Dec. 9-12. China.
11.
Lu, M., and Liu, S., 1996, “A Multi-Axial Thermo-Mechanical Fatigue Tester for Electronic Packaging Materials,” in Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME, EEEP-Vol. 17, pp. 87–92.
12.
Ren
W.
Lu
M.
Liu
S.
Shangguan
D.
1997
, “Thermal Mechanical Property Testing of New Lead Free Solder Joints
,” Journal of Soldering & Surface Mount Technology
, Vol. 9
, No. 3
, pp. 37
–40
.13.
Shangguan
D.
Achari
A.
Green
W.
1994
, “Application of Lead Free Eutectic Sn-Ag Solder in No-Clean Thick Film Electronic Modules
,” IEEE Trans. on Components, Packaging, and Manufacturing Tech.—Part B
, Vol. 17
, pp. 603
–611
.14.
Shangguan, D., and Gao, G., 1996, “Environmentally Conscious Manufacturing Technologies for Automotive Electronics,” Proceedings, Second Inter. Symp. on Electronic Packg. Tech., Shanghai, China, pp. 391–402.
15.
Shangguan, D., and Achari, A., 1995, United States Patent, Patent Number: 5,429,689, Jul. 4, 1995.
16.
Xie
D. J.
Chan
Y. C.
Lai
J. K. L.
Hui
I. K.
1996
, “Fatigue Life Estimation of Surface Mount Solder Joints
,” IEEE Trans. on Components, Packaging, and Manufacturing Tech.—Part B
, Vol. 19
, No. 3
, pp. 669
–677
.17.
Zhang
Z.
Yao
D.
Shang
J. K.
1996
, “Fatigue Crack Initiation in Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 118
, pp. 41
–44
.
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