Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.

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