Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.
Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
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Chai, H., and Zohar, Y. (September 1, 1999). "Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions." ASME. J. Electron. Packag. September 1999; 121(3): 137–142. https://doi.org/10.1115/1.2792675
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