Analysis for an avionics application typical of remotely located, intermittently operated avionics on aircraft and missiles show that a large weight reduction (about 9:1) can be obtained by using recently developed microencapsulated phase change materials technology instead of a solid aluminum plate for a passive heat sink. Tests with a configuration based on the typical avionics application used for analysis show good agreement with analysis. Use of microencapsulated rather than bulk phase change materials avoids a number of design problems previously encountered with application of such materials.

1.
Colvin, D. P., and Mulligan, J. C., 1990, “Method of Using a PCM Slurry to Enhance Heat Transfer in Liquids,” U.S. Patent 4911232, March 27, 1990.
2.
Duffy, V., 1970, “Thermal Control Though Fusible Materials,” Electronic Packaging and Production, July, pp. 45–53.
3.
Hale, D. V., Hoover, M. J., and O’Neill, M. J., 1971, Phase Change Materials Handbook, NASA CR-61363.
4.
Leoni, M., and Amon, C. H., 1997a, “Thermal Design for Transient Operation of the TIA Wearable Portable Computer,” Thermal Management: Design ASME INTERpack ’97 Conference, Vol. 2, pp. 2151–2161.
5.
Leoni, M., and Amon, C. H., 1997b, “Transient Thermal Design of Wearable Computers With Embedded Electronics Using Phase Change Materials,” Thermal Management of Hand-Held, Wearable and Portable Electronics ASME National Heat Transfer Conference, Vol. 5, pp. 49–56.
6.
Mulligan, J. C., Colvin, D. P., and Bryant, Y. G., 1994, “Use of Two-Component Fluids of Micro-Encapsulated Phase-Change Materials for Heat Transfer in Spacecraft Thermal Analysis,” AIAA 94-2004.
7.
Pal
D.
, and
Joshi
Y. K.
,
1997
, “
Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
119
, pp.
40
50
.
8.
Pal
D.
, and
Joshi
Y. K.
,
1998
, “
Thermal Management of an Avionics Module Using Solid-Liquid Phase-Change Materials
,”
Journal of Thermophysics and Heat Transfer
, Vol.
12
, No.
1
, pp.
1
7
.
This content is only available via PDF.
You do not currently have access to this content.