The constitutive modeling approach based on the disturbed state concept (DSC) described in Part I, provides a unified basis for the characterization of thermomechanical response of materials and joints in electronic chip-substrate systems. Using the material constants given in Part I, the DSC model predictions, obtained by integrating the incremental constitutive equations, are shown here to provide satisfactory backpredietions of stress-strain, fatigue, and failure responses of typical solder materials. The DSC also provides a simple criterion based on the critical disturbance to identify cyclic fatigue failure. Model predictions show good correlation with those from previous models. It is also shown how the DSC model can be used for design applications. Overall, based on Papers I and II, it can be stated that the DSC can provide a new and powerful means to characterize the thermomechanical behavior of materials and joints in a number of problems in electronic packaging.

Issue Section:
Technical Papers
Topics:
Constitutive equations, Design, Electronic packaging, Thermomechanics, Failure, Fatigue, Fatigue failure, Modeling, Solders, Stress
1.
Basaran, C., and Desai, C. S., 1994, “Thermomechanical Analysis of Electronic Packaging Problems Using Disturbed State Concept,” report to NSF, Dept. of Civil Engng. and Engng. Mechanics, The University of Arizona, Tucson, AZ.
2.
Chia, J., and Desai, C. S., 1994, “Constitutive Modeling of Thermomechanical Response of Materials in Semiconductor Devices Using the Disturbed State Concept,” report to the National Science Foundation, Dept. of Civil Engng. and Engng. Mechanics., The University of Arizona, Tucson, AZ.
3.
Desai
C. S.
,
Chia
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,
Kundu
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, and
Prince
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,
1997
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Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration
,”
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4.
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5.
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,
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,
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, and
Fine
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,
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, “
Thermomechanical Fatigue Life Prediction of G3Sn/37Pb Solder
,”
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6.
Hall, P. M., and Sherry, W. M., 1986, “Materials, Structures and Mechanics of Joints for Surface-Mount Microelectronics Technology,” Proc., 3rd. Int. Conf. on Techniques des Connexion en Electronique, Welding Society, Miami, FL, pp. 18–20.
7.
Riemer, D. E., 1990, “Prediction of Temperature Cyclic Life for SMT Solder Joints on TCE-Mismatched Substrates,” Proc., Elect. Comp., IEEE, NJ, pp. 418–423.
8.
Skipor, A., Harren, S., and Botsis, J., 1992, “Constitutive Characterization of 63/37 Sn/Pb Eutectic Solder Using the Bodner-Parton Unified Creep-Plasticity Model,” Adv. in Elect. Packaging, Vol. 2, Proceeding’s of the 1992 Joint ASME/JSME Conference on Electronic Packaging, W. T. Chen, and H. Abe, eds., ASME, NY, pp. 661–672.
9.
Solomon, H. D., 1985, “Low Cycle Fatigue of 60/40 Solder Plastic Strain Limited vs. Displacement Limited Testing,” Proc., ASM Elect. Packaging: Materials and Processes, Metals Park, OH, pp. 29–47.
10.
Solomon
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,
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Isothermal Fatigue of LCC/PWB Interconnections
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
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11.
Zubelewicz
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Guo
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Fine
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, and
Kerr
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,
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Micromechanical Method to Predict Fatigue Life of Solder
,”
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