In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board are used as demonstration vehicles. Transient heat conduction and nonlinear elastic-plastic-contact finite element analyses are carried out on PTHs and vias under the extreme conditions of perfect and zero barrel-laminate adhesion. In general, the maximum equivalent plastic strains in PTHs and vias with strong barrel-laminate adhesion are not large enough to fracture the plating. Fracture is possible at or near the innerplane junction when barrel-laminate adhesion is lost. The possibility of plating fracture in a blind via is strongly dependent on the tolerances in manufacturing process parameters such as drill depth and laminate thickness.
Skip Nav Destination
e-mail: ganesh@colorado.edu
Article navigation
December 1997
Technical Papers
The Impact of Interfacial Adhesion on PTH and Via Stress State
G. Subbarayan,
G. Subbarayan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
e-mail: ganesh@colorado.edu
Search for other works by this author on:
K. Ramakrishna,
K. Ramakrishna
Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730
Search for other works by this author on:
B. G. Sammakia
B. G. Sammakia
Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760
Search for other works by this author on:
G. Subbarayan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
e-mail: ganesh@colorado.edu
K. Ramakrishna
Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730
B. G. Sammakia
Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760
J. Electron. Packag. Dec 1997, 119(4): 260-267 (8 pages)
Published Online: December 1, 1997
Article history
Received:
September 1, 1995
Revised:
August 20, 1996
Online:
November 6, 2007
Citation
Subbarayan, G., Ramakrishna, K., and Sammakia, B. G. (December 1, 1997). "The Impact of Interfacial Adhesion on PTH and Via Stress State." ASME. J. Electron. Packag. December 1997; 119(4): 260–267. https://doi.org/10.1115/1.2792247
Download citation file:
Get Email Alerts
Cited By
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Related Articles
Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
J. Electron. Packag (March,2001)
An Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle
J. Electron. Packag (March,1994)
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
J. Electron. Packag (December,2008)
Related Proceedings Papers
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Adhesion Testing of Deposit-Substrate Combinations
Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment