In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board are used as demonstration vehicles. Transient heat conduction and nonlinear elastic-plastic-contact finite element analyses are carried out on PTHs and vias under the extreme conditions of perfect and zero barrel-laminate adhesion. In general, the maximum equivalent plastic strains in PTHs and vias with strong barrel-laminate adhesion are not large enough to fracture the plating. Fracture is possible at or near the innerplane junction when barrel-laminate adhesion is lost. The possibility of plating fracture in a blind via is strongly dependent on the tolerances in manufacturing process parameters such as drill depth and laminate thickness.
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e-mail: ganesh@colorado.edu
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December 1997
Technical Papers
The Impact of Interfacial Adhesion on PTH and Via Stress State
G. Subbarayan,
G. Subbarayan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
e-mail: ganesh@colorado.edu
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K. Ramakrishna,
K. Ramakrishna
Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730
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B. G. Sammakia
B. G. Sammakia
Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760
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G. Subbarayan
Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427
e-mail: ganesh@colorado.edu
K. Ramakrishna
Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730
B. G. Sammakia
Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760
J. Electron. Packag. Dec 1997, 119(4): 260-267 (8 pages)
Published Online: December 1, 1997
Article history
Received:
September 1, 1995
Revised:
August 20, 1996
Online:
November 6, 2007
Citation
Subbarayan, G., Ramakrishna, K., and Sammakia, B. G. (December 1, 1997). "The Impact of Interfacial Adhesion on PTH and Via Stress State." ASME. J. Electron. Packag. December 1997; 119(4): 260–267. https://doi.org/10.1115/1.2792247
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