The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

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