A new configuration for testing thin layers of solder is introduced and employed to study the effects of strain rate and thickness on the mechanical response of eutectic Sn-Pb solder. The solder in the test is loaded under a well defined state of pure shear stress. The stress and deformation in the solder are measured very accurately to produce a reliable stress-strain curve. The results show that both the stress needed for plastic deformation and ductility increase with increasing strain rate.

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