The performance of micro heat exchangers fabricated on silicon wafers and consisting ofpin arrays and straight channels is evaluated theoretically using three-dimensional numerical simulations. The coolant is liquid nitrogen and the objective is to maintain the wafer’s temperature below 90K so as to facilitate the use of high temperature superconductor interconnects in multichip modules. Both developing and periodic flows are considered. Comparisons of the performance of various geometric configurations are presented It is demonstrated that by proper selection of the heat of the heat exchanger’s geometry, the thermal resistance can be minimized.

1.
Ashiwake
N.
,
Nakayama
W.
,
Daikoku
T.
, and
Kobayashi
F.
,
1983
, “
Forced Convective Heat Transfer From LSI Packages in an Air-Cooled Wiring Card Array
,”
Heat Transfer in Electronic Equipment
, ASME HTD
28
, pp.
35
42
.
2.
Asako
Y.
, and
Faghri
M.
,
1989
, “
Three-Dimensional Heat Transfer Analysis of Arrays of Heated Square Blocks
,”
International Journal of Heat Mass Transfer
, Vol.
32
, No.
2
, pp.
395
405
.
3.
Aung, W., 1991, Cooling Techniques for Computers, Hemisphere, Washington, DC.
4.
Bejan
A.
, and
Morega
A. M.
,
1993
, “
Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection
,”
ASME JOURNAL OF HEAT TRANSFER
, Vol.
115
, pp.
75
81
.
5.
Bergles
A. E.
,
1986
, “
The Evolution of Cooling Technology for Electrical, Electronic and Microelectronic Equipment
,”
Heat Transfer in Electronic Equipment
, ASME, HTD-
57
, pp.
1
9
.
6.
Bergles, A. E., 1990, “Heat Transfer in Electronic and Microelectronic Equipment,” Proceedings of the International Center for Heat and Mass Transfer, Vol. 29, Hemisphere.
7.
Hayashi
M.
,
Sakurai
A.
, and
Ohya
Y.
,
1986
, “
Wake interference of a Row of Normal Flat Plates Arranged Side by Side in a Uniform Flow
,”
J. Fluid Mechanics
, Vol.
164
, pp.
1
25
.
8.
Keyes
R.
,
1984
, “
Heat Transfer in Forced Convection Through Fins
,”
IEEE Transactions on Electron Devices
, ED-
31
(
9
), pp.
1218
1221
.
9.
Kishimoto
T.
, and
Sasaki
S.
,
1987
, “
Cooling Characteristics of Diamond-Shaped Interrupted Cooling Fin for High-Power LSI Devices
,”
Electronics Letters
, Vol.
23
, pp.
456
457
.
10.
Patankar
S. V.
,
Liu
C. H.
, and
Sparrow
E. M.
,
1977
, “
Fully Developed Flow and Heat Transfer in Ducts Having Streamwise-Periodic Variations of Cross-Sectional Area
,”
ASME JOURNAL OF HEAT TRANSFER
, Vol.
99
, pp.
180
186
.
11.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, McGraw-Hill, New York, NY.
12.
Riddle, R. A., and Bernhardt, A. F., 1992, “The Microchannel Heat Sink with Liquid Nitrogen Cooling,” Paper No. UCRL-JC-109267, Lawrence Livermore National Laboratory, CA.
13.
Riddle, R. A., and Berhnardt, A. F., 1993, “The Onset of Nucleate and Fully Developed Boiling in Microchannel Heatsinks with Liquid Nitrogen Cooling,” Paper No. UCRL-JC-114405, Lawrence Livermore National Laboratory.
14.
Riddle, R. A., Contolini, R. J., and Bernhardt, A. F., 1991, “Design Calculations for the Microchannel Heat Sink,” Paper No. UCRL-JC-105120, Lawrence Livermore National Laboratory.
15.
Riddle, R. A., 1993, “Thermal Stresses in the Microchannel Heatsink Cooled by Liquid Nitrogen,” Paper No. UCRL-JC-114422, Lawrence Livermore National Laboratory.
16.
Samalam
V. K.
,
1989
, “
Convective Heat Transfer in Microchannels
,”
Journal of Electronic Materials
, Vol.
18
, No.
5
, pp.
611
617
.
17.
Tatsutani
K.
,
Devarakonda
R.
, and
Humphrey
J. A. C.
,
1993
, “
Unsteady Flow and Heat Transfer for Cylinder Pairs in a Channel
,”
International Journal of Heat Mass Transfer
, Vol.
36
, pp.
3311
3328
.
18.
Tuckerman
D. B.
, and
Pease
R. F. W.
,
1981
, “
High Performance Heat Sinking for VLSI
,”
IEEE Electron Device Letters
, EDL-
2
, pp.
126
129
.
19.
Tuckerman, D., and Pease, R., 1984, “Heat Transfer Microstructures for Integrated Circuits,” Ph.D. Thesis, Stanford, University, Stanford, CA.
20.
Weisberg
A.
,
Bau
H. H.
, and
Zemel
J.
,
1992
, “
Analysis of Microchannels for Integrated Cooling
,”
International Journal of Heat Mass Transfer
, Vol.
35
, pp.
2465
2474
.
21.
White, F. M., 1974, Viscous Fluid Flow, McGraw-Hill, New York, NY, p. 123.
22.
Yin, X., 1995, “Micro-Heat Exchangers,” Ph.D. diss., University of Pennsylvania, Philadelphia, PA.
23.
Yin, X., and Bau, H. H., 1995, “Micro Heat Exchangers Consisting of Pin Arrays,” Cooling and Thermal Design of Electronic Systems, ASME 95 IMFCE Conference Proceedings, HTD 319/EEP 15, C. H. Amon, pp. 59–66.
24.
Zdravkovich
M. M.
,
1977
, “
Review of Flow Interference Between Two Circular Cylinders in Various Arrangements
,”
ASME Journal of Fluid Engineering
, Vol.
99
, pp.
618
632
.
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