Abstract

The performance of micro heat exchangers fabricated on silicon wafers and consisting ofpin arrays and straight channels is evaluated theoretically using three-dimensional numerical simulations. The coolant is liquid nitrogen and the objective is to maintain the wafer’s temperature below 90K so as to facilitate the use of high temperature superconductor interconnects in multichip modules. Both developing and periodic flows are considered. Comparisons of the performance of various geometric configurations are presented It is demonstrated that by proper selection of the heat of the heat exchanger’s geometry, the thermal resistance can be minimized.

Issue Section:
Technical Papers
Topics:
Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers, Temperature, Thermal resistance
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