Boiling jet impingement heat transfer from a simulated electronic chip to Fluorinert FC-72 within a clamshell avionic module was investigated for dependence upon inlet fluid temperature, nozzle diameter, nozzle to chip spacing, jet velocity, and chip length. The clamshell module was designed and fabricated to accommodate both single and multiple chip boards and to demonstrate the feasibility of an ultra-high power (on the order of several kilowatts) module. Critical heat flux (CHF) was found to be directly dependent upon subcooling and jet velocity, but relatively unaffected by the nozzle to chip spacing variations examined. The effect of varying the chip size was evaluated and found to produce higher CHF values as chip size was decreased. A correlation accounting for both geometric and subcooling effects was adapted to predict the CHF database with a mean absolute error of 9.6 percent. The module is shown to be capable of dissipating a heat load of 12,000 W at a module flow rate of 8.01 × 10−4 m3/s (12.7 gpm), thus eclipsing the current technology available in avionic cooling.

1.
Barwick, M., Midkiff, M., and Seals, D., 1991, “Liquid Flow-Through Cooling For Avionics Applications,” IEEE National Aerospace and Electronics Conf., Vol. 1, Dayton, OH, pp. 227–230.
2.
Chu, R. C., 1986, “Heat Transfer in Electronic Systems,” 8h Int. Heat Transfer Conf., C. L. Tien, V. P. Carey, and J. K. Ferrell, ed. Vol. 1, San Francisco, CA, pp. 293–305.
3.
Estes
K.
, and
Mudawar
I.
,
1995
, “
Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
118
, pp.
127
134
.
4.
Jimenez
P. E.
, and
Mudawar
I.
,
1994
, “
A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
116
, pp.
220
229
.
5.
Johns, M. E., 1994, “Application of Jet Impingement Boiling in an Ultra-High Power Avionic Clamshell Module,” Masters thesis, School of Mechanical Engineering, Purdue University, West Lafayette, IN.
6.
Mackowski, M. J., 1991, “Requirements for High Flux Cooling of Future Avionics Systems,” Aerospace Technology Conf. and Exposition, Long Beach, CA, SAE Paper No. 912104.
7.
Maddox
D. E.
, and
Mudawar
I. A.
,
1989
, “
Single and Two-Phase Convective Heat Transfer from Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel
,”
ASME JOURNAL OF HEAT TRANSFER
, Vol.
111
, pp.
1045
1052
.
8.
Mudawar
I.
,
Jimenez
P. E.
, and
Morgan
R. E.
,
1994
, “
Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionics Systems
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
116
, pp.
116
125
.
9.
Mudawar
I.
, and
Wadsworth
D. C.
,
1991
, “
Critical Heat Flux from a Simulated Chip to a Confined Rectangular Impinging Jet of Dielectric Liquid
,”
Int. J. Heat Mass Transfer
, Vol.
34
, pp.
1465
1479
.
10.
Nonn, T., Dagan, Z., and Jiji, L. M., 1988, “Boiling Jet Impingement Cooling of Simulated Microelectronic Heat Sources,” ASME Paper No. 88-WA/EEP-3.
This content is only available via PDF.
You do not currently have access to this content.