The rapid advancement of integrated circuits and associated electronic technologies have placed increasing demands on electronic packaging and its material structures in terms of the reliability requirements. In addition to the thermally induced stresses, electronic packages often experience dynamic external loads during shipping, handling, and/or operation. This is especially important for automotive, military, and commercial avionics operating environments. These dynamic loads give rise to large dynamic stresses in the leads causing fatigue failures. For peripheral leaded packages the corner leads are the most highly stressed leads. This paper addresses the determination of the out-of-plane displacement of the corner leads of peripheral leaded components when the local peripheral leaded component/board assembly is subjected to bending moments in two directions. The solution is achieved by using a combination of Finite Element Analysis (FEA), Design of Experiments (DOE), and analytical techniques. The out-of-plane displacement can then be applied as a boundary condition on a local lead model to determine the stresses which in turn can be used to estimate the fatigue life.

1.
Barker
D. B.
, and
Sidharth
,
1994
, “
Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
116
, No.
2
, pp.
92
97
.
2.
Barker
D. B.
,
Chen
Y. S.
, and
Dasgupta
A.
,
1993
, “
Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
115
, No.
2
, pp.
195
200
.
3.
Engel
P. A.
,
1990
, “
Structural Analysis for Circuit Card Systems Subjected to Bending
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
112
, No.
1
, pp.
2
10
.
4.
Engel
P. A.
,
Caletka
D. V.
, and
Palmer
M. R.
,
1991
, “
Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
114
, pp.
203
210
.
5.
Gould, P. L., 1988, Analysis of Shells and Plates, Springer Verlag Inc., NY.
6.
Pitarresi, J. M., and Akanda, A., 1993, “Random Vibration Response of a Surface Mount Lead/Solder Joint,” Proceedings of the 1993 ASME International Electronics Packaging Conference, Binghamton, New York.
7.
Lau, J. H., 1991, ed., Solder Joint Reliability—Theory and Applications, Van Nostrand Reinhold, New York.
8.
Sidharth, 1995, “Fatigue Life Estimation of Component Leads Subject to PWB Vibration,” Ph.D. Dissertation, Mechanical Engineering, University of Maryland, College Park.
9.
Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, 2nd ed., John Wiley & Sons, New York.
This content is only available via PDF.
You do not currently have access to this content.