Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

1.
Cao
H. C.
, and
Evans
A. G.
,
1989
, “
An Experimental Study of the Fracture Resistance of Bimaterial Interface
,”
Mech. Mater.
, Vol.
7
, pp.
295
305
.
2.
Charalambides
P. G.
,
Lund
J.
,
Evans
A. G.
, and
McMeeking
R. M.
,
1989
, “
A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
,”
ASME Journal Appl. Mech.
, Vol.
56
, pp.
77
82
.
3.
Dundurs
J.
,
1969
, “
Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading
,”
ASME Journal Appl. Mech.
, Vol.
36
, pp.
650
652
.
4.
Hu
K. X.
,
Chandra
A.
, and
Huang
Y.
,
1994
, “
On Crack, Rigid-Line Fiber and Interface Interactions
,”
Mech. Mater.
, Vol.
19
, pp.
15
28
.
5.
Hutchinson
J. W.
,
Mear
M. E.
, and
Rice
J. R.
,
1987
, “
Crack Paralleling an Interface Between Dissimilar Materials
,”
ASME Journal Appl. Mech.
, Vol.
54
, pp.
828
832
.
6.
Kardomateas
G. A.
,
Pelegri
A. A.
, and
Malik
B.
,
1995
, “
Growth of Internal Delaminations Under Cyclic Compression in Composite Plates
,”
Journal Mech. Phys. Solids
, Vol.
43
, pp.
847
868
.
7.
Kardomateas
G. A.
, and
Pelegri
A. A.
,
1994
, “
The Stability of Delamination Growth in Compressively Loaded Composites Plates
,”
Int. Journal Fracture
, Vol.
65
, pp.
261
276
.
8.
Liechti
K. M.
, and
Chai
Y.-S.
,
1991
, “
Biaxial Loading Experiments for Determining Interfacial Fracture Toughness
,”
ASME Journal Appl. Mech.
, Vol.
58
, pp.
680
687
.
9.
O’Dowd
N. P.
,
Shih
C. F.
, and
Stout
M. G.
,
1992
, “
Test Geometries for Measuring Interfacial Fracture Toughness
,”
Int. Journal Solids Structures
, Vol.
29
, pp.
571
589
.
10.
Rice
J. R.
,
1965
, “
A Path Independent Integral and Approximate Analysis of Strain Concentration by Notches and Cracks
,”
ASME Journal Appl. Mech.
, Vol.
35
, pp.
379
368
.
11.
Rice
J. R.
,
1988
, “
Elastic Fracture Mechanics Concepts for Interfacial Cracks
,”
ASME Journal Appl. Mech.
, Vol.
55
, pp.
98
103
.
12.
Sarihan, V., Miller, B., Padmanabhan, P., and Cheparak, M., 1994, “Impact of Diecoat Delamination on Package Encapsulation Stress,” Structural Analysis in Microelectronics and Fiber Optics, E. Suhir, Ed., ASME Winter Annual Meeting, Chicago, IL.
13.
Shih, C. F., 1991, “Cracks on Bimaterial Interfaces: Elasticity and Plasticity Aspects,” Materials Sci. Engng., A143, pp. 77–90.
14.
Shih
C. F.
, and
Asaro
R. J.
,
1988
, “
Elastic-Plastic Analysis of Cracks on Bimaterial Interfaces: Part I, Small Scale Yielding
,”
ASME Journal Appl. Mech.
, Vol.
55
, pp.
299
316
.
15.
Shih
C. F.
, and
Asaro
R. J.
,
1989
, “
Elastic-Plastic Analysis of Cracks on Bimaterial Interfaces: Part II, Structures of Small-Scale Yielding Fields
,”
ASME Journal Appl. Mech.
, Vol.
56
, pp.
763
779
.
16.
Suo
Z.
,
1990
, “
Singularities, Interfaces and Cracks in Dissimilar Anisotropic Media
,”
Proc. R. Soc. Lond.
,
A427
, pp.
331
358
.
17.
Wang
J. S.
, and
Suo
Z.
,
1990
, “
Experimental Determination of Interfacial Toughness Curves Using Brazil-Nut-Sandwiches
,”
Acta Metall.
, Vol.
38
, pp.
1279
1290
.
18.
Yao, D., and Shang, J. K., 1995, “Effect of Load-Mix on Fatigue Crack Growth in Sn-Pb Solder Joint,” ASME Winter Meeting, 95-WA/EEP-10.
19.
Zywicz
E.
, and
Parks
D. M.
,
1989
, “
Elastic Yield Zone Around an Interface Crack Tip
,”
ASME Journal Appl. Mech.
, Vol.
55
, pp.
299
316
.
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