Verified/predictive modeling has become an integral part of electronic packaging product development in order to reduce costs and cycle time. In this paper, interferometric displacement measurement methods are utilized to verify the validity of numerical models for microelectronics packaging design. Three optical methods with submicron sensitivities are employed: moire´ interferometry, microscopic moire´ interferometry and Twyman/Green interferometry. The first two provide contour maps of in-plane displacement fields, and the third maps out-of-plane displacement fields. Their high sensitivity and high spatial resolution make them ideally suited for verification of numerical models. By combining numerical modeling and experimental verification until the results merge, numerical models become more accurate and dependable. Then, the models can be applied extensively to optimize the package designs with confidence that the models provide effective information on material and geometry sensitivity.

1.
Bhandarkar
S. M.
,
Dasgupta
A.
,
Barker
D.
,
Pecht
M.
, and
Engelmaier
W.
,
1992
, “
Influence of Selected Design Variables on Thermo-Mechanical Stres Distributions in Plated-Through-Hole Structures
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
114
, No.
1
, pp.
8
13
.
2.
Clementi, J., McCreary, J., Niu, T. M., Palomaki, J., and Varcoe, J., 1993, “Flip-Chip Encapsulation on Ceramic Substrates,” Proceedings of 43rd Electronics Components & Technology Conference, pp. 175–181.
3.
Corbin
J. S.
,
1993
, “
Finite Element Analysis for Solder Ball Connect (SBC) Structural Design Optimization
,”
IBM Journal of Research and Development
, Vol.
37
, No.
5
, pp.
585
596
.
4.
Guo
Y.
,
Lim
C. K.
,
Chen
W. T.
, and
Woychik
C. G.
,
1993
, “
Solder Ball Connect (SBC) Assemblies Under Thermal Loading: I. Deformation Measurement via Moire´ Interferometry, and Its Interpretation
,”
IBM Journal of Research and Development
, Vol.
37
, No.
5
, pp.
635
648
.
5.
Han
B.
, and
Guo
Y.
,
1995
, “
Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
117
, No.
3
, pp.
185
191
.
6.
Han, B., Caletka, D., and Guo, Y., 1995, “On the Effect of Moire´ Specimen Preparation on Solder Ball Strains of Ball Grid Array Package Assembly,” Proceedings of the 1995 SEM Spring Conference on Experimental Mechanics, Grand Rapid, MI.
7.
Hecht, E., 1987, Optics, Addison-Wesley Publishing Company, Reading, M. A, pp. 385–386.
8.
Post, D., Han, B., and Ifju, P., 1994a, “Moire´ Interferometry,” High Sensitivity Moire´: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York, NY, Chapter 4, pp. 135–226.
9.
Post, D., Han, B., and Ifju, P., 1994b, “Microscopic Moire´ Interferometry,” High Sensitivity Moire´: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York, NY, Chapter 5, pp. 227–255.
10.
Post, D., Hart, B., and Ifju, P., 1994c, High Sensitivity Moire´: Experimental Analysis for Mechanics and Materials, Springer-Verlag, New York, NY, Chapter 2, pp. 48–53.
11.
Post
D.
, and
Wood
J.
,
1993
, “
Determination of Thermal Strains by Moire´ Interferometry
,”
Experimental Mechanics
, Vol.
29
, No.
3
, pp.
18
20
.
12.
Powell, D. O., and Trivedi, A. K., 1993, “Flip-Chip on FR-4 Integrated Circuit Package,” Proceedings of 43rd Electronics Components & Technology Conference, pp. 182–186.
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