The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

Issue Section:
Technical Papers
Topics:
Creep, Reliability, Solder joints, Fatigue life, Design, Interferometry, Lasers, Modeling, Simulation, Solders, Stress, Wings
1.
Bonner, K. and Cornford, S., 1994, “Summary of Phase I Round Robin Solder Joint Life Prediction Model Results,” JPL Technical Report, Oct.
2.
Constable, J., 1993, Private Communication, Elec. Eng. Dept., SUNY Binghamton.
3.
Fultyn, R. V. 1989, “Statistical Analysis of Solder Joint Pull Strength of 50 mil Pitch Rigid Gull Wing and J-bend SMT Devices,” Internal report #TR89–0052/SMTE, Digital Equipment Corp.
4.
Fultyn, R. V., 1989, “Statistical Analysis of Solder Joint Pull Strength of 25 mil Pitch Rigid Gull Wing SMT Devices,” Internal report #TR90–0062/SMTE, Digital Equipment Corp.
5.
Iannuzzelli, R. J., 1992, “Predicting Solder Joint Reliability - Model Validation,” Proc 43rd ECTC, June, pp. 839–851.
6.
Knecht
S.
, and
Fox
L. R.
,
1990
, “
Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder
,”
IEEE Trans Comp Hybrids Manufacturing Tech.
, Vol.
CHMT–13
, pp.
424
–
433
.
7.
Ko, W. H., 1994, “Finite Element Modeling of a Leadless Chip Carrier,” MS thesis, State University of New York at Binghamton.
8.
Shine
M. C.
, and
Fox
L. R.
,
1987
, “
Fatigue of Solder Joints in Surface Mount Devices
,”
ASTM Tech Publ.
,
942
, pp.
588
–
610
.
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 by The American Society of Mechanical Engineers
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