A simple model is presented to predict the mechanical squashing or stretching of an axisymmetric solder joint when subjected to a ramp loading. This is a situation which can frequently arise, accidentally or by design, in the processing of flip chip solder bumps, or in surface mounted Ball Grid Array modules. Excessive squashing can have ramifications for subsequent processing or for joint reliability. The proposed method, while involving an extremely simple algorithm, has been found to agree well with experimental data, and is very general in its applicability.

1.
Oshima, M., Satoh, R., Hirota, K., and Ishi, I., 1984, “New Micro-Soldering Technology and Its Application to VLSI,” Proc. First IEEE-CHMT Symposium, 1984, pp. 219–226.
2.
Tribula
D.
, and
Morris
J. W.
,
1990
, “
Creep in Shear of Experimental Solder Joints
,”
ASME Journal of Electronic Packaging
, Vol.
112
, No.
3
, pp.
87
93
.
3.
Hatsuda, T., Doi, H., Sakata, S., and Hayashida, T., 1992, “Creep Behavior of Flip-Chip Solder Joints,” ASME Paper 92-WA/EEP-8.
4.
Seyyedi
J.
, and
Sauber
J.
,
1992
, “
Stress-Rupture of Laser Bonded Solder Joints
,” in ASME,
Advances in Electronic Packaging
, Vol.
1
, pp.
319
324
.
5.
Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” Proc. 1992 Electronic Components and Technology Conference, pp. 538–551.
6.
Frost, H. J., Lavery, P. R., and Lutender, S. D., 1987, “Microstructure and Mechanical Properties of Lead Tin Solder Alloys,” Proc. Third ASM Conference on Packaging, pp. 259–267.
7.
Lauer
L. D.
,
1986
, “
Dynamic Mechanical Testing of Solder and Solder Joints, 1986
,”
Circuit World
, Vol.
13
, pp.
13
17
.
8.
Busso
E. P.
,
Kitano
M.
, and
Kumazawa
T.
,
1992
, “
A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints
,”
ASME J. Eng. Mat. and Tech.
, Vol.
114
, pp.
331
337
.
9.
Srivastava, K. K., Cooper-Joselow, A. H., Goldmann, L. S., Smith, L. S., and Eve, J. L., 1986, internal IBM report TR22.2708.
10.
Blodgett
A. J.
,
1983
, “
Microelectronic Packaging
,”
Scientific American
, Vol.
249
, No.
1
, pp.
86
96
.
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