Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3/s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2. Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.

1.
Bar-Cohen
A.
,
1993
, “
Thermal Management of Electronic Components with Dielectric Liquids
,”
JSME International Journal Series B
, Vol.
35
, No.
1
, pp.
1
25
.
2.
Copeland, D., 1992, “Single-Phase and Boiling Cooling of a Small Heat Source by Multiple Nozzle Jet Impingement,” ASME Winter Annual Meeting, Paper 92-WA/EEP-4; 1996, International Journal of Microelectronic Packaging, in press.
3.
Hansen
L. G.
, and
Webb
B. W.
,
1993
, “
Air Jet Impingement Heat Transfer from Modified Surfaces
,”
International Journal of Heat and Mass Transfer
, Vol.
36
, No.
4
, pp.
989
997
.
4.
Mudawar
I.
, and
Maddox
D. E.
,
1990
, “
Enhancement of Critical Heat Flux from High Power Microelectronic Heat Sources in a Flow Channel
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
112
, No.
3
, pp.
241
248
.
5.
Mudawar
I.
, and
Wadsworth
D. C.
,
1991
, “
Critical Heat Flux from a Simulated Chip to a Confined Rectangular Impinging Jet of Dielectric Liquid
,”
International Journal of Heat and Mass Transfer
, Vol.
34
, No.
6
, pp.
1465
1479
.
6.
Priedeman, D., Callahan, V., and Webb, B. W., “Enhanced Surface Liquid Jet Impingement Heat Transfer,” Enhanced Cooling Techniques for Electronics Applications, ASME HTD-Vol. 263, pp. 43–48.
7.
Sullivan, P. F., Ramadhyani, S., and Incropera, F. P., 1992, “Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets,” Topics in Heat Transfer—Volume 2, ASME HTD-Vol. 206–2, pp. 103–110.
8.
Teuscher, K. L., Ramadhyani, S., and Incropera, F. P., 1993, “Jet Impingement Cooling of an Array of Discrete Heat Sources with Extended Surfaces,” Enhanced Cooling Techniques for Electronics Applications, ASME HTD-Vol. 263, pp. 1–10.
9.
Wadsworth
D.
, and
Mudawar
I.
,
1992
, “
Enhancement of Single-Phase Heat Transfer and Critical Heat Flux from an Ultra-High-Flux Simulated Microelectronic Heat Source to a Rectangular Impinging Jet of Dielectric Liquid
,”
ASME JOURNAL OF HEAT TRANSFER
, Vol.
114
, No.
3
, pp.
764
768
.
10.
Yang
W.-J.
,
Takizawa
H.
, and
Vrable
D. L.
,
1991
, “
Augmented Boiling on Copper-Graphite Composite Surface
,”
International Journal of Heat and Mass Transfer
, Vol.
34
, No.
11
, pp.
2751
2758
.
This content is only available via PDF.
You do not currently have access to this content.