A new test to measure the adhesion of thin polymeric coatings (the so-called “edge delamination test”) has been recently proposed by Shaffer et al. (1993), where the authors translate the test measurements into the values of the debond energy by finite element modeling. The present paper suggests another interpretation of the mechanics of the edge delamination test and translates the measurements of this test into conventional values of the adhesion strength—the ultimate peeling stress, using a simple closed-form solution.

1.
Mirman, B. A., Mirman, I. B., 1992, “Thermal Stresses in Axisymmetric Bimaterial Assemblies: Microelectronic Applications,” Proc. of the Joint ASME/JSME Conf., pp. 425–436.
2.
Mittal
K. L.
,
1974
,
Journal of Adhesion
, Vol.
7
, pp.
377
378
.
3.
Mittal, K. L., 1978, “Adhesion Measurement: Recent Progress, Unsolved Problems, and Prospects, Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings,” ASTM STP 640, K. L. Mittal, ed., ASTM, pp. 5–17.
4.
Shaffer II, E. O., McGarry, F. J., and Trusell, F., 1993, “Edge Delamination Testing: A Method for Measuring the Adhesion of Thin-Film Coatings in Microelectronic Applications,” MRS, Spring Annual Meeting.
5.
Shaffer II, E. O., 1994, M.I.T., Private communication.
6.
Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Int. Symp. Microelectr., pp. 383–392.
7.
Timoshenko, S., and Goodier, J. N., 1951, Theory of Elasticity, McGraw-Hill, N.Y.
8.
Timoshenko, S., and Woinowsky-Krieger, S., 1959, Theory of Plates and Shells, McGraw-Hill, N.Y.
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