Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.

1.
U.S. Air Force Avionics Integrity Program notes, 1989.
2.
Bar-Cohen, A., Kraus, A. D., and Davidson, S. F., June, 1983, “Thermal Frontiers in The Design and Packaging of Microelectronic Equipment,” Mechanical Engineering.
3.
Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, McGraw-Hill, New York, N.Y.
4.
Yeh, L. T., 1987 “Future Thermal Design and Management of Electronic Equipment,” Heat Transfer in High Technology and Power Engineering, Edited by Yang and Mori, Hemisphere Publishing, New York, N.Y.
5.
Bergles, A. E., Chu, R. C., and Seely, J. H., Mar. 1977 “Survey of Heat Transfer Technologies Applied to Electronic Packages,” Proceedings of Technical Program National Electronic Packaging and Production Conference, Anaheim, CA.
6.
Antonetti, V. W., and Simmons, R. E., 1985, “Bibliography of Heat Transfer in Electronic Equipment,” IEEE Trans Component, Hybrid and Manufacturing Technology, CHMT-8.
7.
Simmons, R. E., 1990, “Bibliography of Heat Transfer in Electronic Equipment,” Advances in Thermal Modeling of Electronic Components and Systems, Edited by Bar-Cohen and Kraus, Vol. 2.
8.
Peterson, G. P., and Ortega, A., 1990, “Thermal Control of Electronic Equipment and devices,” Advances in Heat Transfer, Oxford, U.K., Pergammon.
9.
Yovanovich, M. M., 1973, “Effect of Foils upon Joint Resistance: Evidence of Optimum Thickness,” AIAA Progress in Astronautics and Aeronautics, Thermal Control and Radiation, Vol. 3.
10.
Peterson, G. P., and Fletcher, L. S., 1988, “Thermal Contact Conductance in The Presence of Thin Metal Foils,” AIAA-88-0466.
11.
Antonetti, V. W., and Yovanovich, M. M., 1985, “Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment,” ASME Journal of Heat Transfer, Vol. 107.
12.
Kang, T. K., Peterson, G. P., and Fletcher, L. S., 1989, “Effect of Metallic Coatings on The Thermal Contact Conductance of Turned Surfaces,” ASME Paper No. 89-HT-18.
13.
Chung, K-C., and Sheffield, J. W., 1995, “Enhancement of Thermal contact Conductance of Coated Junctions,” J. of Thermophysics and Heat Transfer, Vol. 9, No. 2.
14.
Cook, R. S., Token, R. H., and Colkings, R. L., 1982, “A Novel Concept for Reducing Thermal Contact Resistance,” Presented at the 3rd AIAA/ASME Joint Thermophysics, Fluid, Plasma and Heat Transfer Conference, St. Louis, MO., June 11–17.
15.
Tuckman, D. H., 1984, “Heat Transfer Microstructures for Integrated Circuit Heat Sink,” Ph.D. thesis, Stanford University.
16.
Peterson, G. P., and Fletcher, L. S., Mar. 1987, “Thermal Contact Resistance of Silicon Chip Bonding Materials,” Proceedings of The 1st International Symposium on Cooling Technology for Electronic Equipment.
17.
Yovanovich, M. M., and Antonetti, V. W., 1988, “Application of Thermal Contact Resistance Theory to Electronic Packages,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, Edited by Bar-Cohen and Kraus, Hemisphere Publishing.
18.
Fletcher, L. S., 1990, “A Review of Thermal Enhancement Techniques for Electronic Systems,” IEEE Trans on Component, Hybrid, and Manufacturing Technology, Vol. 13, No. 4.
19.
Kim, S. H., Anand, N. K., and Fletcher, L. S., 1989, “Free Convection Between Series of Vertical-Parallel Plates with Embedded Line Heat Sources,” ASME HTD-Vol. 121.
20.
Cha, W., and Lloyd, J. R., 1989, “Numerical Study of Natural Convection Between Two Vertical Parallel Plates with One Oscillating Surface Temperature,” ASME HTD-Vol. 121.
21.
Khalilollahi, A., and Sammakia, B. G., 1989, “Transient Mixed Convection in Air Adjacent to Discrete Uniform Heat Sources,” ASME HTD-Vol. 121.
22.
Lin, P. C., 1989, “An Experiment Study of Natural Convection from Protruding Arrays on a Vertical Plate With and Without an Opposing Wall for Various Fluids,” Ph.D. thesis, Oregon State University, Corvallis, Or.
23.
Sparrow, E. W., and Vemuri, S. B., 1986, “Orientation Effects on Natural Convection/Radiation Heat Transfer From Pin Fin Arrays,” Int. J. Heat Mass Transfer, Vol. 29.
24.
Alessio, M. E., and Kaminski, D. A., 1989, “Natural Convection and Radiation Heat Transfer from an Array of Inclined Pin Fins,” ASME Journal of Heat Transfer, Vol. 111.
25.
Asako, Y., and Faghri, M., 1987, “Three-Dimensional Heat Transfer and Fluid Flow analysis of Arrays of Rectangular Blocks Encountered in Electronic Equipment,” ASME Paper No. 87-HT-73.
26.
Sparrow, E. M., Yanezmoreno, A. A., and Otis, Jr., D. R., 1984, “Convective Heat Transfer Response to Height Difference in and Array of Block-Like Electronic Components,” Int. J. Heat Mass Transfer, Vol. 27.
27.
Souza Mendes, P. R., and Santos, W. F. N., 1987, “Heat Transfer and Pressure Drop Experiments in Air-Cooled Electronic-Component Arrays,” J. Thermophysics, Vol. 1, No. 4.
28.
Sridhar, S., Faghri, M., and Lessmann, R. C., 1990, “Heat Transfer Behavior Including Thermal Wake Effects in Forced Air Cooling of Arrays of Rectangular Blocks,” ASME HTD-Vol. 153.
29.
Faghri, M., Ray, A., Sridhar, S., and Schmidt, R., 1991, “Entrance Heat Transfer Correlation for Air Cooling of Arrays of Rectangular Blocks,” ASME HTD-Vol. 183.
30.
Wang, Y., and Ghajar, A. J., 1991, “Effect of Component Geometry and Layout on Flow Distribution for Surface Mounted Electronic Components: A Smoke Flow Visualization Study,” ASME HTD-Vol. 183.
31.
Wirtz, R. A., and McAuliffe, W., 1989, “Experimental Modeling of Convection Downstream from an Electronic Package Row,” ASME HTD-Vol. 111.
32.
Rizk, T. A., and Kleinstreuer, C., 1989, “Forced Convection Cooling of A Linear of Blocks in Open and Porous Matrix Channels,” ASME HTD-Vol. 111.
33.
Yimer, B., and Bouzid, A., 1989, “Thermal Performance Characteristics of Air-Cooled Cold Plate for Electronic Cooling,” ASME HTD-Vol. 11.
34.
Anderson, A. M., and Moffat, R. J., 1991, “Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing,” ASME Journal of Heat Transfer, Vol. 113.
35.
Estes, R. C., 1989, “Thermal Characterization of Chip-On-Board Packaging Mechanisms,” ASME HTD-Vol. 111.
36.
Matsushima, H., and Yanazida, T., 1993, “Heat Transfer from LSI Packages with Longitudinal Fins in A Free Air Stream,” Advances in Electronic Packaging, ASME Proceedings, EEP-Vol. 4–2.
37.
Lee, R. S., Huang, H. C., and Chen, W. Y., 1990, “A Thermal Characteristic Study of Extruded Type Heat Sinks in Considering Air Flow Bypass Phenomenon,” Proceedings of 6th Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.
38.
Chapman, C. L., Lee, S., and Schmidt, B. L., 1994, “Thermal Performance of An Elliptical Pin Fin Heat Sink,” Proceedings of 10th Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.
39.
Hilbert, C., Sommerfeldt, S., Gupta, O., and Herrell, D. J., 1990, “High Performance Air Cooled Heat Sinks for Integrated Circuits,” IEEE Trans on Components, Hybrides, and Manufacturing Technology, Vol. 13, No. 4.
40.
Moffat, R. J., and Ortega, A., “Direct Air-Cooling of Electronic Components,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, Edited by Bar-Cohen and Kraus, Hemisphere Publishing Corporation.
41.
Keyhani, M., Prasad, V., Chen, R., and Wong, T. T., 1988, “Free Convection Heat Transfer from Discrete Heat Sources in a Vertical Cavity,” ASME HTD Vol. 100.
42.
Sathe, S. B., and Joshi, Y., 1990, “Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: Effects of Thermal Properties, Geometric Dimensions, and Boundary Conditions,” SME HTD Vol. 153.
43.
Joshi, Y., Kelleher, M. D., Powell, M., and Torres, E. I., 1991, “Natural Convection Heat Transfer from an Array of Rectangular Protrusion in an Enclosure Filled with Dielectric Liquid,” ASME HTD-Vol. 183.
44.
Chen, I., Keyhani, and Pitts, D. R., 1988, “An Experimental Study of Natural Convection Heat Transfer in a Rectangular Enclosure with Protruding Heaters,” Presented at National Heat Transfer Conference, Houston, TX.
45.
Keyhani, M., Prasad, V., and Cox, R., 1988, “An Experimental Study of Natural Convection in a Vertical Cavity with Discrete Heat Sources,” ASME Journal of Heat Transfer, Vol. 110.
46.
Keyhani, M., Chen, I., and Pitts, D. R., 1990, “The Aspect Ratio Effect on Natural Convection in an Enclosure with Protruding Heat Sources,” Present at the AIAA/ASME Thermophysics and Heat Transfer Conference, Seattle, WA.
47.
Nakayama, W., Nakajima, T. Mohashi, S., and Kuwahara, H., 1989, “Modeling of Temperature Transient of Microporous Studs in Boiling Dielectric Fluid after Stepwise Power Application,” ASME HTD-Vol. 111.
48.
Bergles, A. E., and Park, K. A., 1988, “Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux,” ASME Journal of Heat Transfer, Vol. 110.
49.
Mudawar, I., and Anderson, T. M., 1989, “High Heat Flux Electronic Cooling by Means of Pool Boiling—Part I: Parametric Investigation of The Effects of Coolant Variation, Pressurization, Subcooling and Surface Augmentation,” ASME HTD-Vol. 111.
50.
Mudawar, I., and Anderson, T. M., 1989, “High Heat Flux Electronic Cooling by Means of Pool Boiling—Part II: Optimization of Enhanced Surface Geometry,” ASME HTD-Vol. 111.
51.
Cokmez-Tuzla, A. F., Tuzla, K., and Chen, J. C., 1989, “Natural Circulation Boiling for Cooling of Electronic Chips in Cryogenic Nitrogen,” SME HTD-Vol. 111.
52.
You, S. M., Simon, T. W., and Bar-Cohen, A., 1992, “Pool Boiling Heat Transfer with an Array of Flush-Mounted Square Heaters,” Presented at 28th National Heat Transfer Conference, San Diego, CA, Aug. 9–12.
53.
Bergles, A. E., and Kim, C. J., 1988, “A Method to Reduce Temperature Overshoots in Immersion Cooling of Microelectronic Devices,” CH2590-8/88, IEEE.
54.
Lee, T. Y. T., Mahalingam, M., and Normington, P. J. C., 1992, “Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixture,” ASME HTD-Vol. 206-2.
55.
Norgmington, P. J. C., Mahalingam, M., and Lee, T. Y. T., 1992, “Thermal Management Control Without Overshoot Using Combinations of Boiling Liquids,” IEEE Trans on Component, Hybrid, and Manufacturing Technology, Vol. 15, No. 5.
56.
Phadke, N. K., Bhavnani, S. H., Goyal, A., Jaeger, R. C., and Goodling, J. S., 1992, “Re-Entrant Cavity Surface Enhancements for Immersion Cooling of Silicon Multichip Packages,” IEEE Components, Hybrides, and Manufacturing Technology, Vol. 15, No. 5.
57.
You, S. M., Simon, T. W., and Bar-Cohen, A., 1992, “A Technique for Enhancing Boiling Heat Transfer with Application to Cooling of Electronic Equipment,” IEEE Trans on Component, Hybrid, and Manufacturing Technology, Vol. 15, No. 5.
58.
Bergles, A. E., and Bar-Cohen, A., 1990, “Direct Liquid Cooling of Microelectronic Components,” Advances in Thermal Modeling of Electronic Components and Systems, Edited by Bar-Cohen and Kraus, Vol. 2.
59.
Bar-Cohen, A., 1991, “Thermal Management of Electronic Components with Dielectric Liquids,” ASME/JSME Thermal Engineering Joint Conference, Vol. 2.
60.
Yeh, L. T., 1985, “Analytical Solutions for a Counter Flow Heat Exchanger with Space-Dependent Wall Heat Dissipations,” ASME HTD-Vol. 48.
61.
Yeh, L. T., and Gingrich, W. K., 1986, “Numerical Solutions for a Multiple-Channel Counter Flow Heat Exchanger with Space-Dependent Wall Heat Dissipation,” Proceedings of the 8th International Heat Transfer Conference, Vol. 6.
62.
Gingrich, W. K., Yeh, L. T., and Fuhr, T. D., 1989, “Transient Temperature Distribution for a Multiple-Channel Counter Flow Heat Exchanger with Space-Dependent Wall Heat Dissipations,” ASME Winter Annual Meeting, San Francisco, CA.
63.
Yeh, L. T., 1987, “Thermal Design of a Multiple-Channel Bidirectional Cold Plate for Solid State Phased Array Radars,” Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, Honolulu, HI.
64.
Yeh, L. T., 1993, “An Experimental Study of Offset Fins in a Narrow Channel,” Proceedings of First International Conference on Aerospace Heat Exchanger Technology, Palo Alto, CA.
65.
Chung, B. T. F., Zhang, Z. J., Li, G., and Yeh, L. T., 1993, “Thermally Developing Convection from Newtonian Flow in Rectangular Ducts With Uniform Heating,” J of Thermophysics and Heat Transfer, Vol. 7, No. 3.
66.
Samant, K. R., and Simon, T. W., 1989, “Heat Transfer from a Small Heated Region to R-113 and FC-72,” ASME Journal of Heat Transfer, Vol. 111.
67.
Lee, T. Y., and Simon, T. W., 1989, “Critical Heat Flux in Forced Convection Boiling from Small Regions,” ASME HTD-Vol. 119.
68.
Lee, T. Y., and Simon, T. W., 1989, “High Heat Flux in Forced Convection Boiling from Small Regions,” ASME HTD-Vol. 111.
69.
Mudawart, I., and Maddox, D. E., 1989, “Enhancement of Critical Heat Flux from High Power Microelectronic Heat Sources in a Flow Channel,” ASME HTD-Vol. 111.
70.
Iversen, A. H., 1989, “Uniform Temperature, Ultrahigh Flux Heat Sinks Using Curved Surface Subcooled Nucleate Boiling,” IEEE Paper No. Ch2688-0/89/0000-0088 5th IEEE Semiconductor Thermal Measurement and Management Symposium.
71.
Galloway, J. E., and Mudawar, I., 1989, “Boiling Heat Transfer from a Simulated Microelectronic Heat Source to a Dielectric Liquid Film Driven by a Rotating Stirrer,” ASME HTD-Vol. 111.
72.
Hollworth, B. R., and Durbin, M., 1989, “Impingement Cooling of Electronics,” ASME HTD-Vol. 111.
73.
Hamadah, T. T., 1989, “Impingement Cooling of Simulated Electronics Package with a Square Array of Round Air Jets,” ASME HTD-Vol. 111.
74.
Stevens, J., and Webb, B. W., 1989, “Local Heat Transfer Coefficient Under an Axisymmetric, Single-Phase Liquid Jet,” ASME HTD-Vol. 111.
75.
Wadsworth, D. C., and Mudawart, I., 1989, “Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid,” ASME HTD-Vol. 111.
76.
Heindel, T. J., Ramadhyani, S., and Incropera, F. P., 1992, “Surface Enhancement of a Heat Sources Exposed to a Circular Jet with Annual Collection of the Spent Fluid,” ASME HTD-Vol. 206-2.
77.
Sullivan, P. F., Ramadhyani, S., and Incropera, F. P., 1992, “Use of Smooth and Roughened Spreader Plates to Enhance Impingement Cooling of Small Heat Sources with Single Circular Liquids Jets,” ASME HTD-Vol. 206-2, 1992.
78.
Gavali, S., and Miura, K., Karki, K., and Patankar, S., 1992, “Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity,” ASME HTD-Vol. 206-2.
79.
Womac, D. J., Ramadhyani, S., and Incropera, F. P., 1993, “Correlation Equations for Impingement Cooling of Small Heat Sources with Single Circular Liquid Jets,” ASME Journal of Heat Transfer, Vol. 115.
80.
Zumbrunnen, D. A., and Aziz, M., 1993, “Convective Heat Transfer Enhancement Due to Intermittency in an Impingement Jet,” ASME Journal of Heat Transfer, Vol. 115.
81.
Nonn, T., Dagan, Z., and Jiji, L. M., 1989, “Jet Impingement Flow Boiling of a Mixture of FC-72 and FC-87 Liquids on A Simulated Electronic Chip,” ASME HTD-111.
82.
Yao, S. C., Deb, S., and Hammouda, W. R., 1989, “Impacting Spray Boiling for Thermal Control of Electronic Systems,” ASME HTD-Vol. 111.
83.
Tilton, D. E., Tilton, C. L., Pais, M. R., Morgan, M. J., and Chow, L. C., 1992, “High Flux Spray Cooling in Simulated Multichip Module,” ASME HTD-Vol. 206-2.
84.
Pais, M. R., Leland, J. L., Chang, W. S., and Chow, L. C., 1993, “Jet Impingement Cooling Using a Jet Fuel,” ASME Paper No. 93-HT-22.
85.
Yang, J., Chow, L. C., and Pais, M. R., 1993, “Nucleate Boiling Heat Transfer in Spray Cooling,” ASME Paper No. 93-HT-29.
86.
Thmoas, M., Ruel, C., and Donato, M., 1989, “Characterization of a Flat Plate Heat Pipe for Electronic Cooling in a Space Environment,” ASME HTD-Vol. 111.
87.
Ciekurs, P. V., and Brokaw, W. D., 1988, “Passive Cold Plate Pipes Heat From RF Power Devices,” Microwaves & RF, Dec.
88.
Cotter, T. P., 1984, “Principles And Prospects of Micro Heat Pipes,” Proceedings of 5th International Heat Pipes Conference, Tsukuba, Japan.
89.
Babin, B. R., Peterson, G. P., and Wu, D., 1990, “Steady State Modeling And Testing of a Micro Heat Pipe,” ASME Journal of Heat Transfer, Vol. 112.
90.
Wu, D., and Peterson, G. P., 1991, “Investigation of the Transient Characteristics of a Micro Heat Pipe,” J of Thermophysics and Heat Transfer, Vol. 5, No. 2.
91.
Wu, D., Peterson, G. P., and Change, W. S., 1991, “Transient Experimental Investigation of Micro Heat Pipes,” J of Thermophysics and Heat Transfer, Vol. 5, No. 4.
92.
Peterson, G. P., Duncan, A. B., and Weichold, M. H., 1993, “Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers,” ASME Journal of Heat Transfer, Vol. 115.
93.
Marto, P. J., and Peterson, G. P., 1988, “Advances in Thermal Modeling on Electronic Components and Systems,” Vol. 1, Edited by Bar-Cohen and Kraus, Hemisphere Publishing.
94.
Tuckerman, D. B., and Pease, F. F., 1981, “High Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, EDL-2.
95.
Wu, P. Y., and Little, W. A., 1983, “Measurement of Friction Factor for The Flow of Gases in Very Fine Channels Used Microminiature Joule-Thompson Refrigerators,” Cryogenics, Vol. 23(5).
96.
Wu, P. Y., and Little, W. A., 1984, “Measurement of Heat Transfer for The Flow of Gases in Very Fine Channels Heat Exchangers Used Microminiature Refrigerators,” Cryogenics, Vol. 24(8).
97.
Choi, S. B., Barron, R. F., and Warrington, R. O., 1991, “Liquid Flow and Heat Transfer in Microtubes,” Micromechanical Sensors, Actuator, and Systems, ASME DSC-Vol. 32, Edited by D. Cho et al.
98.
Harley, J., Pfahler, J., Bau, H., and Zemel, J., 1991, “Gas and Liquid Flow in Small Channels,” Micromechanical Sensors, Actuators, and Systems, ASME DSC-Vol. 32, Ed. by D. Cho et al.
99.
Harley, J., Pfahler, J., Bau, H., and Zemel, J., 1989, “Transport Processes in Micron and Submicron Channels,” ASME HTD-Vol. 116.
100.
Peng, X. F., and Wang, B. X., 1994, “Liquid Flow and Heat Transfer in Microchannels With/Without Phase Change,” Keynote Lecture, Tenth International Heat Transfer Conference, Brighton, England, Aug. 14–18.
101.
Wang, B. X., and Peng, X. F., 1994, “Experimental Investigation on Forced Flow Convection of Liquid Flow Through Microchannels,” Int. J. Heat Mass Transfer, Vol. 37, Suppl. 1.
102.
Peng, X. F., Wang, B. X., Peterson, G. P., and Ma, H. B., 1995, “Experimental Investigation of Heat Transfer in Flat Plates with Rectangular Microchannels,” Int. J. Heat Mass Transfer, Vol. 38.
103.
Wang, B. X., and Peng, X. F., 1993, “Forced-Flow Convection and Flow Boiling Heat Transfer Through Microchannels,” Int. J. Heat Mass Transfer, Vol. 36, No. 14.
104.
Bowers, M. B., and Mudawar, I., 1994, “High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-Channel and Micro-Channel Heat Sinks,” Int. J. Heat Mass Transfer, Vol. 37, No. 2.
105.
Jacobi, A. M., 1989, “Flow and Heat Transfer in Microchannels Using a Microcontinuum Approach,” Journal of Heat Transfer, Vol. 111.
106.
Mundinger, D., Beach, R., Benett, W., Solarz, R., Krupke, W., Staver, R., and Tuckerman, D., 1988, “Demonstration of High-Performance Silicon Microchannel Heat Exchangers for Laser Diode Array Cooling,” Appl. Phys. Lett. Vol. 63(12).
107.
Schulenbury, N., Kvamme, E., Nelson, A., Roh, J., Phillips, J. R., Mansingh, V., and Blackman, J., 1989, “Evaluation of Air-Cooled Microchannel Heat Sinks,” Proceedings of 9th International Electronics Packaging Conference.
108.
Phillips, R. J., 1990, “Microchannel Heat Sink,” Advances in Thermal Modeling of Electronic Components and Systems, Edited by Bar-Cohen and Kraus, Vol. 2.
109.
Phillips, R. J., 1993, “Review of Microchannel Heat Sink Research and Development,” Proceedings of 2nd International Electronics Packaging Conference.
110.
Rahman, M. M., 1993, “Experiment Measurement of Fluid Flow and Heat Transfer in Microchannel Cooling Passages in a Chip Substrate,” Proceedings of 2nd International Electronics Packaging Conference.
111.
Bowers, M. B., and Mudawar, I., 1993, “Two-phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks—Part I. Design Criteria and Heat Diffusion Constraints,” Proceedings of 2nd International Electronics Packaging Conference.
112.
Bowers, M. B., and Mudawar, I., 1993, “Two-phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sink—Part 2. Flow Rate and Pressure Drop Constraints,” Proceedings of 2nd International Electronics Packaging Conference.
113.
Weisberg, A., Bau, H. H., and Zemel, J., 1992, “Analysis of Microchannels for Integrated Cooling,” Int. J. Heat Mass Transfer, Vol. 35(10).
114.
Estes, R. C., 1992, “The Effect of Thermal Capacitance and Phase Change on Outside Plant Electronic Enclosures,” IEEE Trans. Components, Hybrid and Manufacturing Technology, Vol. 15, No. 5.
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