Environmental Scanning Electron Microscopy (E-SEM) is a technique which provides the capability to investigate surface morphologies over a variety of controllable environmental conditions. This paper discusses the principal of the E-SEM and presents three experimental investigations of failure mechanisms in electronic packages using E-SEM techniques. The first is a study of thermally induced failures of MMIC devices. The second investigation focuses on mechano-sorptive properties of multilayer thin-film polyimides. The third investigation concentrates on relative humidity and thermal cycling effects on interfacial bonding characteristics of resin/fiber interfaces in printed wiring boards, and microcracks surrounding plated-through-holes.

1.
Bahl, I., Griffin, E., Powell, W., and Ring, I., 1986, “A High Speed GaAs Monolithic Transimpedance Amplifier,” Dig. of IEEE MTT-S Ins. Mier. Symp., pp. 35–38.
2.
Eichelberger, C. W., Wojnarowski, R. J., Carlson, R. O., Levinson, L. M., 1988, “HDI Interconnects for Electronic Packaging,” SPIE Symposium on Innovative Science and Technology, pp. 877–889.
3.
Halkias, G., Christou, A., Huang, K., Li, J., and Papanicolaou, N., 1993, “Surface Related Failure Mechanisms in Polyimide Passivated L-Band MMICs,” International Reliability Physics Symposium, pp. 375–379.
4.
Paik, K., Bernard, E., Li, J., and Pecht, M., 1993, “Humidity Cycling Experiment on GE-HDI, Status Report,” RELTECH ISHM.
5.
Poon, S. “High Density Multilevel Copper-Polyimide Interconnects,” 1993, Proceedings NEPCON West, pp. 426–448.
6.
Pecht, M., Dasgupta, A., Evans, John, and Evans, Jillian, 1994, Quality Conformance and Qualification of Electronic Packages, John Wiley Publishing Co., New York, NY.
7.
Pecht, M., 1994, Integrated Circuit, Hybrid and Multichip Module Package Design Guidelines, John Wiley, New York, NY.
8.
Richards, B. P., and Footner, P. K., 1992, The Role of Microscopy in Semiconductor Failure Analysis, Oxford University Press, New York.
9.
Rudra
B.
,
Pecht
M.
, and
Jennings
D.
,
1994
, “
Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates
,”
IEEE Transactions on Components, Packaging, and Manufacturing Techniques
, Part B, Vol.
17
, No.
3
, pp.
269
276
.
10.
Tessier, T. G., Adema, G. M., and Turlik, I., 1989, “Polymer Dielectric for Thin Film Packaging Applications,” Proc. 139th Electronic Component Conference, pp. 127–134.
This content is only available via PDF.
You do not currently have access to this content.