A curing oven that is commonly used in microelectronic manufacturing has been analyzed to determine the causes of contamination of parts passing through the oven, and to eliminate this contamination. During the curing of microelectronic chip packages, a volatile component contained in the bonding epoxy is released as a vapor. This vapor is usually removed (scavenged) by blowing a process gas through jets. However, some condensation of this vapor may (and often does) occur on the chips, contaminating them and rendering them functionally useless. It is desirable to completely eliminate this condensation. This paper presents a flow visualization study of the complicated flow patterns within the oven created by the jet-flows. Vortices are produced due to jet interactions. These vortices inhibit scavenging (entrainment and removal) of the contaminant vapor and are undesirable. A new design that eliminates the vortices and enhances the scavenging is described. In Part II of this study, a numerical simulation of the process is described.

1.
Hu
J. M.
,
Pecht
M.
, and
Dasgupta
A.
,
1993
, “
Design of Reliable Die Attach
,”
J. Microcircuits and Electronic Packaging
, Vol.
16
, pp.
1
22
.
2.
Lage
J. L.
,
Bejan
A.
, and
Anderson
R.
1991
, “
Efficiency of Transient Contaminant Removal from a Slot Ventilated Enclosure
,”
Int. J. Heat Mass Transfer
, Vol.
34
, pp.
2603
2615
.
3.
Lage
J. L.
,
Bejan
A.
, and
Anderson
R.
,
1992
, “
Removal of Contaminant Generated by a Discrete Source in a Slot Ventilated Enclosure
,”
Int. J. Heat Mass Transfer
, Vol.
35
, pp.
1169
1180
.
4.
Rieder
W.
, and
Delfanian
F.
,
1991
, “
Simulations of Airborne Pollutant Levels and Infiltration Flows in an Enclosure
,”
ASME Journal Solar Energy Engineering
, Vol.
113
, pp.
236
243
.
5.
Kapoor
K.
, and
Jaluria
Y.
,
1993
, “
Penetrative Convection of a Plane Turbulent Wall Jet in a Two-Layer Thermally Stable Environment: a Problem in Enclosure Fires
,”
Int. J. Heat Mass Transfer
, Vol.
36
, pp.
155
167
.
6.
Goldman
D.
, and
Jaluria
Y.
,
1986
, “
Effect of Opposing Buoyancy on the Flow in Free and Wall Jets
,”
J. Fluid Mechanics
, Vol.
166
, pp.
41
56
.
7.
Martin, H., 1977, “Heat and Mass Transfer between Impinging Gas Jets and Solid Surfaces,” Hartnett, J. P., and Irvine, T. F. Jr., eds. Advances in Heat Transfer, Vol. 13, Academic Press, New York.
8.
Besserman
D. L.
,
Ramadhyani
S.
, and
Incropera
F. P.
,
1991
, “
Numerical Simulation of Laminar Flow and Heat Transfer for Liquid Jet Impingement Cooling of a Circular Heat Source with Annular Collection of the Spent Fluid
,”
Numerical Heat Transfer, Part A
, Vol.
20
, pp.
263
278
.
9.
Yuan
T. D.
,
1993
, “
Heat Transfer Characteristics of Jet Impingement with Fine Concentric Annular Channel
,”
Int. J. Microcircuits and Electronic Packaging
, Vol.
16
, pp.
137
144
.
10.
Sparrow
E. M.
,
Xu
Z. X.
, and
Azevedo
L. F. A.
,
1987
, “
Heat (Mass) Transfer for Circular Jet Impingement on a Confined Disk With Annular Collection of the Spent Air
,”
ASME Journal of Heat Transfer
, Vol.
109
, pp.
329
335
.
11.
Schrader, H., 1961, “Trocknung feuchter Oberfla¨chen mittels Warmluftstrahlung,” Verein Deutscher Ingenieur Zeitschrift, p. 484.
12.
Goldstein
R. J.
, and
Seol
W. S.
,
1991
, “
Heat transfer to a row of impinging circular air jets including the effect of entrainment
,”
Int. J. Heat Mass Transfer
, Vol.
34
, pp.
2133
2147
.
13.
Goldstein
R. J.
, and
Timmers
J. F.
,
1982
, “
Visualization of Heat Transfer From Arrays of Impinging Jets
,”
Int. J. Heat Mass Transfer
, Vol.
25
, pp.
1857
1868
.
14.
Merzkirch, W., 1987, Flow Visualization. Academic Press, New York, NY, pp. 24–37.
15.
Prandtl, L., and Tietjens, O. G., 1957, Fundamentals of Hydro- and Aeromechanics, Dover, New York, NY, pp. 197–200.
This content is only available via PDF.
You do not currently have access to this content.