A new type of immersion cooled module, the BTPFL-C2, was developed for thermal management of future high flux avionics while conforming to the geometrical constraints of existing military modules and avionic enclosures. The BTPFL-C2 houses two circuit boards separated by a flow distribution plate and employs two sleeveless quick connection coolant couplers. The flow distribution plate supplies the coolant inside the module into parallel narrow channels formed between the distribution plate and the surfaces of the chips. Theoretical predictions of the thermal performance of the BTPFL-C2 were substantiated by experimental data using a test module populated with ten chips. Increasing the coolant subcooling at the module inlet was found to decrease pressure drop across the module, decrease the coolant flow rate requirements, and extend the upper cooling limit of the BTPFL-C2. These results reveal the BTPFL-C2 is capable of dissipating an order of magnitude more heat than today’s most advanced avionic module. At an inlet subcooling of 40.3°C, the BTPFL-C2 could dissipate over 3000 W using only about 0.051 kg/s (0.50 gpm) of Fluorinert FC-72 and a pressure drop of only 2.8 kPa (0.41 psi).

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