Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporate into the design models for multichip modules and other electronic packages. These properties are also required in assessing reliability and aiding in screening and qualification procedures. This paper presents the test methods and experimental results on various thermomechanical properties of low temperature cofired ceramic over the the temperature range of −55°C to +250°C. Material properties determined from the tests include the modulus of elasticity, the modulus of rupture, the fracture toughness, and the coefficient of thermal expansion.
This content is only available via PDF.
Copyright © 1994
by The American Society of Mechanical Engineers
You do not currently have access to this content.
